Abstract: The heat sink has an interior and has a first exterior surface and a second exterior surface, and includes a first heat removal region disposed in the interior. The first heat removal region defines a first cavity and is at least partially filled with a liquid. The first heat removal region transfers a first amount of heat from a first electronic device via a pool boiling phenomenon when the first electronic device is disposed on the first exterior surface. A first conduction-inhibiting region is disposed proximate the first cavity. A second heat removal region is disposed in the interior. The second heat removal region defines a second cavity and is at least partially filled with the liquid. The second heat removal region transfers a second amount of heat from a second electronic device via the pool boiling phenomenon when the second electronic device is disposed on the first exterior surface.

Abstract: A multi-mode, two-phase cooling module (10) comprises a first housing portion (20), a second housing portion (30), and a third housing portion (40). Cooling liquid (22) is held in first housing portion (20), and one or more electronic components (24) are mounted onto an external surface of first housing portion (20) for being pool cooled. The second housing portion (30) has one or more spray nozzles (32) secured to one of the internal surfaces, and one or more electronic components (34) mounted onto one of the external surfaces in a position opposite spray nozzles (32). The third housing portion (40) has one or more condensers (42) on the internal surfaces, and one or more heat sinks (44) on the external surfaces. One or more electric fans (46), piezo-electronic fans, or spray nozzles (48) may be provided adjacent to internal surfaces of the condensers (42). The cooling module (10) is made of a thermally conductive material.