Patents by Inventor Kurt B. Smith

Kurt B. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11069890
    Abstract: The present invention relates to methods of fabrication of hollow shells/spheres/particles, core-shell particles and composite materials made from these particles.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: July 20, 2021
    Assignee: RUTGERS, THE STATE UNIVERSITY OF NEW JERSEY
    Inventors: Maria S. Tomassone, Kurt B. Smith
  • Patent number: 10575413
    Abstract: Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: February 25, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Kurt B. Smith
  • Publication number: 20190326592
    Abstract: The present invention relates to methods of fabrication of hollow shells/spheres/particles, core-shell particles and composite materials made from these particles.
    Type: Application
    Filed: May 31, 2017
    Publication date: October 24, 2019
    Inventors: Maria S. Tomassone, Kurt B. Smith
  • Patent number: 10257944
    Abstract: Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: April 9, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Kurt B. Smith
  • Publication number: 20180375237
    Abstract: Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Inventor: Kurt B. Smith
  • Patent number: 10045452
    Abstract: Electronic device structures may include a sleeve member including a cavity extending from a first end of a body toward a second, opposite end, and an opening in communication with the cavity at the first end of the sleeve member. A frame configured to engage an electronic device member, such as a substrate bearing electronic components, may be sized and shaped to be positioned at least partially in the cavity. The frame may include a connector interface at a first end of the frame, the connector interface sized and shaped to at least partially occlude the opening and to accommodate a portion of the substrate extending therethrough and comprising a blade bearing electrical contacts. Support members may extend from proximate the connector interface toward a second end of the body within the cavity when the frame is located at least partially in the cavity.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: August 7, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Dennis M. Terenzio, Kurt B. Smith
  • Publication number: 20180166811
    Abstract: Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 14, 2018
    Inventor: Kurt B. Smith
  • Publication number: 20180103555
    Abstract: Electronic device structures may include a sleeve member including a cavity extending from a first end of a body toward a second, opposite end, and an opening in communication with the cavity at the first end of the sleeve member. A frame configured to engage an electronic device member, such as a substrate bearing electronic components, may be sized and shaped to be positioned at least partially in the cavity. The frame may include a connector interface at a first end of the frame, the connector interface sized and shaped to at least partially occlude the opening and to accommodate a portion of the substrate extending therethrough and comprising a blade bearing electrical contacts. Support members may extend from proximate the connector interface toward a second end of the body within the cavity when the frame is located at least partially in the cavity.
    Type: Application
    Filed: October 12, 2016
    Publication date: April 12, 2018
    Inventors: Dennis M. Terenzio, Kurt B. Smith