Patents by Inventor Kurt Edward Sincerbox

Kurt Edward Sincerbox has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip packaged devices with thermal pad
    Patent number: 11955456
    Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 9, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Anindya Poddar, Ashok Surendra Prabhu, Hau Nguyen, Kurt Edward Sincerbox, Makoto Shibuya
  • FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
    Publication number: 20230005880
    Abstract: In a described example, an apparatus includes: a first package substrate having a die mount surface; a semiconductor die flip chip mounted to the first package substrate on the die mount surface, the semiconductor die having post connects having proximate ends on bond pads on an active surface of the semiconductor die, and extending to distal ends away from the semiconductor die having solder bumps, wherein the solder bumps form solder joints to the package substrate; a second package substrate having a thermal pad positioned with the thermal pad over a backside surface of the semiconductor die, the thermal pad comprising a thermally conductive material; and a mold compound covering a portion of the first package substrate, a portion of the second package substrate, the semiconductor die, and the post connects, thermal pad having a surface exposed from the mold compound.
    Type: Application
    Filed: June 30, 2021
    Publication date: January 5, 2023
    Inventors: Anindya Poddar, Ashok Surendra Prabhu, Hau Nguyen, Kurt Edward Sincerbox, Makoto Shibuya