Patents by Inventor Kurt Eggmann

Kurt Eggmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9908271
    Abstract: In order to produce a plastic container (1,2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: March 6, 2018
    Assignee: Weidman Medical Technology AG
    Inventors: Kurt Eggmann, Karl Mazenauer, Michael Akermann
  • Publication number: 20160121527
    Abstract: In order to produce a plastic container (1,2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 5, 2016
    Applicant: WEIDMANN PLASTICS TECHNOLOGY AG
    Inventors: Kurt EGGMANN, Karl MAZENAUER, Michael AKERMANN
  • Patent number: 9211665
    Abstract: In order to produce a plastic container (1, 2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: December 15, 2015
    Assignee: Weidmann Medical Technology AG
    Inventors: Kurt Eggmann, Karl Mazenauer, Michael Akermann
  • Publication number: 20130048651
    Abstract: In order to produce a plastic container (1, 2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Application
    Filed: May 4, 2011
    Publication date: February 28, 2013
    Applicant: WEIDMANN PLASTICS TECHNOLOGY AG
    Inventors: Kurt Eggmann, Karl Mazenauer, Michael Akermann