Patents by Inventor Kurt Eisenbeiser

Kurt Eisenbeiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240063364
    Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 22, 2024
    Applicant: The MITRE Corporation
    Inventors: Nicholas HUDAK, Kurt Eisenbeiser
  • Patent number: 11855273
    Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: December 26, 2023
    Assignee: The MITRE Corporation
    Inventors: Nicholas Hudak, Kurt Eisenbeiser
  • Patent number: 10991935
    Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: April 27, 2021
    Assignee: The MITRE Corporation
    Inventors: Nicholas Hudak, Kurt Eisenbeiser
  • Publication number: 20200358079
    Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.
    Type: Application
    Filed: May 5, 2020
    Publication date: November 12, 2020
    Applicant: The MITRE Corporation
    Inventors: Nicholas HUDAK, Kurt EISENBEISER
  • Publication number: 20190305292
    Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 3, 2019
    Applicant: The MITRE Corporation
    Inventors: Nicholas HUDAK, Kurt EISENBEISER
  • Patent number: 10418189
    Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: September 17, 2019
    Assignee: The MITRE Corporation
    Inventors: Nicholas Hudak, Alexander Schlichting, Kurt Eisenbeiser
  • Publication number: 20190103235
    Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 4, 2019
    Applicant: The MITRE Corporation
    Inventors: Nicholas HUDAK, Alexander SCHLICHTING, Kurt EISENBEISER
  • Patent number: 10147557
    Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: December 4, 2018
    Assignee: The MITRE Corporation
    Inventors: Nicholas Hudak, Alexander Schlichting, Kurt Eisenbeiser
  • Publication number: 20180075982
    Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 15, 2018
    Applicant: The MITRE Corporation
    Inventors: Nicholas HUDAK, Alexander SCHLICHTING, Kurt EISENBEISER
  • Publication number: 20120214047
    Abstract: Concepts and methods are provided to reduce the cost and complexity of thin film battery (TFB) high volume manufacturing by eliminating and/or minimizing the use of conventional physical (shadow) masks. Laser scribing and other alternative physical maskless patterning techniques meet certain or all of the patterning requirements. In one embodiment, a method of manufacturing thin film batteries comprises providing a substrate, depositing layers corresponding to a thin film battery structure on the substrate, the layers including, in order of deposition, a cathode, an electrolyte and an anode, wherein at least one of the deposited layers is unpatterned by a physical mask during deposition, depositing a protective coating, and scribing the layers and the protective coating. Further, the edges of the layers may be covered by an encapsulation layer. Furthermore, the layers may be deposited on two substrates and then laminated to form the thin film battery.
    Type: Application
    Filed: May 1, 2012
    Publication date: August 23, 2012
    Applicants: Motorola Mobility, Inc., Applied Materials, Inc.
    Inventors: BYUNG SUNG KWAK, Nety M. Krishna, Kurt Eisenbeiser, William J. Dauksher, Jon Candelaria
  • Patent number: 8168318
    Abstract: Concepts and methods are provided to reduce the cost and complexity of thin film battery (TFB) high volume manufacturing by eliminating and/or minimizing the use of conventional physical (shadow) masks. Laser scribing and other alternative physical maskless patterning techniques meet certain or all of the patterning requirements. In one embodiment, a method of manufacturing thin film batteries comprises providing a substrate, depositing layers corresponding to a thin film battery structure on the substrate, the layers including, in order of deposition, a cathode, an electrolyte and an anode, wherein at least one of the deposited layers is unpatterned by a physical mask during deposition, depositing a protective coating, and scribing the layers and the protective coating. Further, the edges of the layers may be covered by an encapsulation layer. Furthermore, the layers may be deposited on two substrates and then laminated to form the thin film battery.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: May 1, 2012
    Assignees: Applied Materials, Inc., Motorola Mobility, Inc.
    Inventors: Byung Sung Kwak, Nety M. Krishna, Kurt Eisenbeiser, William J. Dauksher, Jon Candelaria
  • Patent number: 7105866
    Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: September 12, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Nada El-Zein, Jamal Ramdani, Kurt Eisenbeiser, Ravindranath Droopad
  • Patent number: 7005717
    Abstract: Circuit (10) has a dual layer gate dielectric (29) formed over a semiconductor substrate (14). The gate dielectric includes an amorphous layer (40) and a monocrystalline layer (42). The monocrystalline layer typically has a higher dielectric constant than the amorphous layer.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: February 28, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Kurt Eisenbeiser, Jun Wang, Ravindranath Droopad
  • Publication number: 20050056210
    Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
    Type: Application
    Filed: August 5, 2004
    Publication date: March 17, 2005
    Applicant: MOTOROLA
    Inventors: Nada El-Zein, Jamal Ramdani, Kurt Eisenbeiser, Ravindranath Droopad
  • Publication number: 20050023622
    Abstract: Circuit (10) has a dual layer gate dielectric (29) formed over a semiconductor substrate (14). The gate dielectric includes an amorphous layer (40) and a monocrystalline layer (42). The monocrystalline layer typically has a higher dielectric constant than the amorphous layer.
    Type: Application
    Filed: May 14, 2004
    Publication date: February 3, 2005
    Applicant: MOTOROLA
    Inventors: Kurt Eisenbeiser, Jun Wang, Ravindranath Droopad
  • Patent number: 6750067
    Abstract: A high quality epitaxial layer of monocrystalline Pb(Zr,Ti)O3 can be grown overlying large silicon wafers by first growing an strontium titanate layer on a silicon wafer. The strontium titanate layer is a monocrystalline layer spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: June 15, 2004
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Ramoothy Ramesh, Yu Wang, Jeffrey M. Finder, Kurt Eisenbeiser, Zhiyi Yu, Ravindranath Droopad
  • Patent number: 6638838
    Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
    Type: Grant
    Filed: October 2, 2000
    Date of Patent: October 28, 2003
    Assignee: Motorola, Inc.
    Inventors: Kurt Eisenbeiser, Barbara M. Foley, Jeffrey M. Finder, Danny L. Thompson
  • Patent number: 6590236
    Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: July 8, 2003
    Assignee: Motorola, Inc.
    Inventors: Nada El-Zein, Jamal Ramdani, Kurt Eisenbeiser, Ravindranath Droopad
  • Patent number: 6555946
    Abstract: High quality epitaxial layers of piezoelectric material materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: April 29, 2003
    Assignee: Motorola, Inc.
    Inventors: Jeffrey M. Finder, Kurt Eisenbeiser, Jamal Ramdani, Ravindranath Droopad, William Jay Ooms
  • Patent number: 6482538
    Abstract: A high quality epitaxial layer of monocrystalline Pb(Mg,Nb)O3—PbTiO3 or Pb(Mg1−xNbx)O3—PbTiO3 can be grown overlying large silicon wafers by first growing an strontium titanate layer on a silicon wafer. The strontium titanate layer is a monocrystalline layer spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: November 19, 2002
    Assignee: Motorola, Inc.
    Inventors: Ramamoorthy Ramesh, Yu Wang, Jeffrey M. Finder, Zhiyi Yu, Ravindranath Droopad, Kurt Eisenbeiser