Patents by Inventor Kurt Eisenbeiser
Kurt Eisenbeiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240063364Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.Type: ApplicationFiled: November 1, 2023Publication date: February 22, 2024Applicant: The MITRE CorporationInventors: Nicholas HUDAK, Kurt Eisenbeiser
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Patent number: 11855273Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.Type: GrantFiled: May 5, 2020Date of Patent: December 26, 2023Assignee: The MITRE CorporationInventors: Nicholas Hudak, Kurt Eisenbeiser
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Patent number: 10991935Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.Type: GrantFiled: March 27, 2018Date of Patent: April 27, 2021Assignee: The MITRE CorporationInventors: Nicholas Hudak, Kurt Eisenbeiser
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Publication number: 20200358079Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.Type: ApplicationFiled: May 5, 2020Publication date: November 12, 2020Applicant: The MITRE CorporationInventors: Nicholas HUDAK, Kurt EISENBEISER
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Publication number: 20190305292Abstract: Described are structural electrode and structural batteries having high energy storage and high strength characteristics and methods of making the structural electrodes and structural batteries. The structural batteries provided can include a liquid electrolyte and carbon fiber-reinforced polymer electrodes comprising metallic tabs. The structural electrodes and structural batteries provided can be molded into a shape of a function component of a device such as ground vehicle or an aerial vehicle.Type: ApplicationFiled: March 27, 2018Publication date: October 3, 2019Applicant: The MITRE CorporationInventors: Nicholas HUDAK, Kurt EISENBEISER
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Patent number: 10418189Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.Type: GrantFiled: December 3, 2018Date of Patent: September 17, 2019Assignee: The MITRE CorporationInventors: Nicholas Hudak, Alexander Schlichting, Kurt Eisenbeiser
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Publication number: 20190103235Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.Type: ApplicationFiled: December 3, 2018Publication date: April 4, 2019Applicant: The MITRE CorporationInventors: Nicholas HUDAK, Alexander SCHLICHTING, Kurt EISENBEISER
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Patent number: 10147557Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.Type: GrantFiled: September 13, 2016Date of Patent: December 4, 2018Assignee: The MITRE CorporationInventors: Nicholas Hudak, Alexander Schlichting, Kurt Eisenbeiser
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Publication number: 20180075982Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.Type: ApplicationFiled: September 13, 2016Publication date: March 15, 2018Applicant: The MITRE CorporationInventors: Nicholas HUDAK, Alexander SCHLICHTING, Kurt EISENBEISER
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Publication number: 20120214047Abstract: Concepts and methods are provided to reduce the cost and complexity of thin film battery (TFB) high volume manufacturing by eliminating and/or minimizing the use of conventional physical (shadow) masks. Laser scribing and other alternative physical maskless patterning techniques meet certain or all of the patterning requirements. In one embodiment, a method of manufacturing thin film batteries comprises providing a substrate, depositing layers corresponding to a thin film battery structure on the substrate, the layers including, in order of deposition, a cathode, an electrolyte and an anode, wherein at least one of the deposited layers is unpatterned by a physical mask during deposition, depositing a protective coating, and scribing the layers and the protective coating. Further, the edges of the layers may be covered by an encapsulation layer. Furthermore, the layers may be deposited on two substrates and then laminated to form the thin film battery.Type: ApplicationFiled: May 1, 2012Publication date: August 23, 2012Applicants: Motorola Mobility, Inc., Applied Materials, Inc.Inventors: BYUNG SUNG KWAK, Nety M. Krishna, Kurt Eisenbeiser, William J. Dauksher, Jon Candelaria
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Patent number: 8168318Abstract: Concepts and methods are provided to reduce the cost and complexity of thin film battery (TFB) high volume manufacturing by eliminating and/or minimizing the use of conventional physical (shadow) masks. Laser scribing and other alternative physical maskless patterning techniques meet certain or all of the patterning requirements. In one embodiment, a method of manufacturing thin film batteries comprises providing a substrate, depositing layers corresponding to a thin film battery structure on the substrate, the layers including, in order of deposition, a cathode, an electrolyte and an anode, wherein at least one of the deposited layers is unpatterned by a physical mask during deposition, depositing a protective coating, and scribing the layers and the protective coating. Further, the edges of the layers may be covered by an encapsulation layer. Furthermore, the layers may be deposited on two substrates and then laminated to form the thin film battery.Type: GrantFiled: October 23, 2008Date of Patent: May 1, 2012Assignees: Applied Materials, Inc., Motorola Mobility, Inc.Inventors: Byung Sung Kwak, Nety M. Krishna, Kurt Eisenbeiser, William J. Dauksher, Jon Candelaria
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Patent number: 7105866Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.Type: GrantFiled: August 5, 2004Date of Patent: September 12, 2006Assignee: Freescale Semiconductor, Inc.Inventors: Nada El-Zein, Jamal Ramdani, Kurt Eisenbeiser, Ravindranath Droopad
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Patent number: 7005717Abstract: Circuit (10) has a dual layer gate dielectric (29) formed over a semiconductor substrate (14). The gate dielectric includes an amorphous layer (40) and a monocrystalline layer (42). The monocrystalline layer typically has a higher dielectric constant than the amorphous layer.Type: GrantFiled: May 14, 2004Date of Patent: February 28, 2006Assignee: Freescale Semiconductor, Inc.Inventors: Kurt Eisenbeiser, Jun Wang, Ravindranath Droopad
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Publication number: 20050056210Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.Type: ApplicationFiled: August 5, 2004Publication date: March 17, 2005Applicant: MOTOROLAInventors: Nada El-Zein, Jamal Ramdani, Kurt Eisenbeiser, Ravindranath Droopad
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Publication number: 20050023622Abstract: Circuit (10) has a dual layer gate dielectric (29) formed over a semiconductor substrate (14). The gate dielectric includes an amorphous layer (40) and a monocrystalline layer (42). The monocrystalline layer typically has a higher dielectric constant than the amorphous layer.Type: ApplicationFiled: May 14, 2004Publication date: February 3, 2005Applicant: MOTOROLAInventors: Kurt Eisenbeiser, Jun Wang, Ravindranath Droopad
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Patent number: 6750067Abstract: A high quality epitaxial layer of monocrystalline Pb(Zr,Ti)O3 can be grown overlying large silicon wafers by first growing an strontium titanate layer on a silicon wafer. The strontium titanate layer is a monocrystalline layer spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide.Type: GrantFiled: April 19, 2002Date of Patent: June 15, 2004Assignee: Freescale Semiconductor, Inc.Inventors: Ramoothy Ramesh, Yu Wang, Jeffrey M. Finder, Kurt Eisenbeiser, Zhiyi Yu, Ravindranath Droopad
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Patent number: 6638838Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.Type: GrantFiled: October 2, 2000Date of Patent: October 28, 2003Assignee: Motorola, Inc.Inventors: Kurt Eisenbeiser, Barbara M. Foley, Jeffrey M. Finder, Danny L. Thompson
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Patent number: 6590236Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.Type: GrantFiled: July 24, 2000Date of Patent: July 8, 2003Assignee: Motorola, Inc.Inventors: Nada El-Zein, Jamal Ramdani, Kurt Eisenbeiser, Ravindranath Droopad
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Patent number: 6555946Abstract: High quality epitaxial layers of piezoelectric material materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.Type: GrantFiled: July 24, 2000Date of Patent: April 29, 2003Assignee: Motorola, Inc.Inventors: Jeffrey M. Finder, Kurt Eisenbeiser, Jamal Ramdani, Ravindranath Droopad, William Jay Ooms
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Patent number: 6482538Abstract: A high quality epitaxial layer of monocrystalline Pb(Mg,Nb)O3—PbTiO3 or Pb(Mg1−xNbx)O3—PbTiO3 can be grown overlying large silicon wafers by first growing an strontium titanate layer on a silicon wafer. The strontium titanate layer is a monocrystalline layer spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide.Type: GrantFiled: July 25, 2001Date of Patent: November 19, 2002Assignee: Motorola, Inc.Inventors: Ramamoorthy Ramesh, Yu Wang, Jeffrey M. Finder, Zhiyi Yu, Ravindranath Droopad, Kurt Eisenbeiser