Abstract: A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

Abstract: A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.

Abstract: A support pedestal includes a support member including a resistive layer having a plurality of zones, a routing layer, and a plurality of conductive vias. The plurality of zones are defined by a plurality of independently controllable resistive heating elements. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of conductive vias.

Abstract: The present disclosure provides a support pedestal that includes a support member including a resistive layer having at least two zones, a routing layer, and a plurality of conductive vias. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of vias. The number of zones of the resistive layer is greater than or equal to a number of wires coupled to the routing layer. The routing layer may include a plurality of arm portions that extend from a central region of the routing layer. The support pedestal may further include a second resistive layer disposed along the same plane as the routing layer.

Abstract: A support pedestal includes a substrate, a plurality of resistive heating elements disposed on the substrate and defining a plurality of heating zones, and electric terminals disposed at a central region of the substrate. At least one of the electric terminals is connected to at least two of the plurality of resistive heating elements.

Abstract: A support pedestal is provided that includes a substrate having a top resistive layer defining a first set of zones and a bottom resistive layer defining a second set of zones. Each zone of the first and second set of zones is coupled to at least two electric terminals from among a plurality of electric terminals, and a total number of electric terminals is less than or equal to a total of the first and second set of zones.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. A spacing between the first member and the second member along the adjacent faces is less than 5 ?m and a surface roughness of the adjacent faces of the first and second ceramic members is between 5 mm and 100 nanometers.

Abstract: A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

Abstract: A method of constructing an E-puck includes forming at least one trench into a lower substrate, depositing an electrode material onto the lower substrate and into the at least one trench, removing excess electrode material from the lower substrate to leave the electrode material within the at least one trench to form an electrode, and forming a dielectric on the lower substrate and the electrode such that the electrode is between the lower substrate and the upper substrate. Forming the at least one trench into the lower substrate forms at least one standoff portion adjacent to the at least one trench and the at least one standoff portion reduces dishing of the electrode material during removal of the excess electrode material from the lower substrate.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 ?m.

Abstract: A method of joining is provided. the method includes preparing a first member, preparing a second member, and forming at least one trench in at least one of the first member and the second member. The method further includes placing a strip of solid aluminum material between the first member and the second member across the trench, bringing the first member and the second member together to contact the solid aluminum material and to form an assembly, and applying a force and heat to the assembly above a melting point of the solid aluminum material such that the solid aluminum material flows into the trench. Additionally, the method further includes applying additional heat to the assembly at or above a wetting temperature of the member in which the trench is formed to bond the first member to the second member along adjacent faces and cooling the assembly.

Abstract: A method of constructing a heater includes providing a substrate, forming at least one trench into the substrate, depositing a functional material onto the substrate and into the at least one trench to form a functional element, and providing an electrical termination in contact with the functional element.

Abstract: An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 ?m.

Abstract: A heater includes a ceramic substrate and a heating layer made of aluminum material disposed in the ceramic substrate. The ceramic substrate includes a first plate member in which the heating layer is disposed and a second plate member through which a plurality of first vias made of the aluminum material extend. A routing layer made of the aluminum material can be disposed in the second plate member. The first plate member and the second plate member are bonded to each other by the aluminum material. The ceramic substrate can include a third plate member through which a plurality of second vias made from the aluminum material extend. The second plate member and the third plate member are bonded to each other by the aluminum material. Also, terminal wires can be bonded to the plurality of second vias.

Abstract: The present disclosure provides a support pedestal that includes a support member including a resistive layer having at least two zones, a routing layer, and a plurality of conductive vias. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of vias. The number of zones of the resistive layer is greater than or equal to a number of wires coupled to the routing layer. The routing layer may include a plurality of arm portions that extend from a central region of the routing layer. The support pedestal may further include a second resistive layer disposed along the same plane as the routing layer.

Abstract: A method of constructing a heater includes providing a substrate, forming at least one trench into the substrate, depositing a functional material onto the substrate and into the at least one trench to form a functional element, and providing an electrical termination in contact with the functional element.

Abstract: A support pedestal is provided that includes a substrate having a top resistive layer defining a first set of zones and a bottom resistive layer defining a second set of zones. Each zone of the first and second set of zones is coupled to at least two electric terminals from among a plurality of electric terminals, and a total number of electric terminals is less than or equal to a total of the first and second set of zones.

Abstract: A consultant provides services to participants seeking involvement in early-stage companies, as well as to early-stage companies seeking the involvement of participants. The participants, typically known as angels, generally seek to provide early-stage funding sought by the companies in exchange for equity interests in the companies. The consultant identifies a company and presents the company to several participants. The participants, in turn, have the opportunity to accept a conditional offer by the consultant to perform a due diligence review of the company. The due diligence review is intended to provide the participants a basis for deciding whether to invest in the company. A participant preferably accepts the offer by casting a vote in favor of having the consultant perform the review.