Abstract: An improved spring probe for a connector assembly includes an elongated electrically conductive contact and an elongated helical compression spring disposed about and attached to the contact. The compression spring includes a stabilization section configured to stabilize the spring probe in a cavity of a test socket body during assembly of the test socket body. The spring stabilization section includes integrated opposed stabilization coils to vertically stabilize the spring probe in the cavity. An insulated spacer is disposed on the conductive contact and has an annular surface configured to contact a wall of the cavity to stabilize and isolate the contact within the cavity to provide a controlled impedance coaxial probe.

Abstract: An improved wafer container is provided for use with automated equipment. The container includes a top lid that engages with a bottom base to form a housing having an inner cavity for storing semiconductor wafers. The lid includes a handling member that interfaces with automated equipment for engaging the lid with the base and removing the lid from the base. The container includes latches that can be actuated between a locked position and an unlocked position by automated equipment. The container can hold multiple stacked wafer separator rings, each of which has automation tabs extending outwardly from the ring outer rim. The automation tabs allow for automated equipment to transfer the wafer separators rings between the container and a staging area.

Abstract: An electrical spring probe has an elongated contact and a helical spring. The spring probe is mounted in a through hole of a non-conductive substrate. The elongated contact includes a head with a V-slot groove for engaging a solder ball lead of an IC package, a shoulder providing a surface to retain a helical spring and a beam for providing a short contact path through the spring. The helical spring is disposed about the contact, with contiguous coils on each end. The upper end of the spring is secured to the contact shoulder immediately under the head. The middle coils of the spring have a larger diameter than the contiguous coils on either end to retain the spring probe assembly in the non-conductive substrate. The bottom end of the helical spring has contiguous coils some of which extend below the substrate surface to make electrical contact with a printed circuit board. The bottom contiguous coils are of a reduced diameter and have a center axis offset from the main axis of the spring probe assembly.