Patents by Inventor Kurt Gehrig

Kurt Gehrig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for separating semiconductor devices from a wafer
    Patent number: 9984927
    Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: May 29, 2018
    Assignee: Infineon Technologies AG
    Inventors: Mathias Vaupel, Kurt Gehrig, Kian Pin Queck
  • METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
    Publication number: 20170117183
    Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.
    Type: Application
    Filed: November 23, 2015
    Publication date: April 27, 2017
    Inventors: Mathias VAUPEL, Kurt GEHRIG, Kian Pin QUECK
  • Method and apparatus for separating semiconductor devices from a wafer
    Patent number: 9196535
    Abstract: An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: November 24, 2015
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Mathias Vaupel, Kurt Gehrig, Kian Pin Queck