Patents by Inventor Kurt I. Butler

Kurt I. Butler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7579574
    Abstract: The invention provides molding compounds that are particularly suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article. These compounds are generally liquid thermosetting molding resins which comprise a thermoset resin matrix such as a terephthalate polyester which can include blends of polyester and/or vinyl ester with a significant loading of conductive inorganic filler, typically graphite. The compositions also include flame and sound retardant additives, and glass fibers. They are further formulated to meet the desired molding characteristics; to withstand the operating temperatures to which they will be exposed; and to have a predetermined strength and a desirable user interface including appearance, and odor. Typically, the compounds will have a glass transition temperature from about 160° C. (320° F.) to about 195° C. (383° F.).
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: August 25, 2009
    Assignee: Premix Inc.
    Inventor: Kurt I. Butler
  • Patent number: 7359629
    Abstract: The invention provides blower housings for air handlers and hot air furnaces which are made from molding compounds that allow for wide flexibility in molding complex configurations so as to improve blower efficiency, which improve manufacturing efficiency and safety and provide suitable mechanical properties, safety in use, and sound dampening. These compounds are generally liquid thermosetting molding resins which comprise a thermoset resin matrix such as a isophthalate polyester having a specific loading of glass reinforcing fibers. The compositions also include flame retardant additives. They are further formulated to meet the desired molding characteristics; to withstand the operating temperatures to which they will be exposed; and to have a predetermined strength and a desirable user interface including appearance, and odor. Typically, the compounds will have a glass transition temperature from about 160° C. (320° F.) to about 185° C. (365° F.).
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: April 15, 2008
    Assignee: Premix Inc.
    Inventors: Kurt I. Butler, Steven T. Searl
  • Patent number: 7170038
    Abstract: The invention provides molding compounds that are particularly suitable to be molded into an article such as a heating element that will conduct heat and not burn when an electric current is passed through the article. These compounds are generally liquid thermosetting molding resins which comprise a thermoset resin matrix such as a terephthalate polyester which can include blends of polyester and/or vinyl ester with a significant loading of conductive inorganic filler, typically graphite. The compositions also include flame and sound retardant additives, and glass fibers. They are further formulated to meet the desired molding characteristics; to withstand the operating temperatures to which they will be exposed; and to have a predetermined strength and a desirable user interface including appearance, and odor. Typically, the compounds will have a glass transition temperature from about 160° C. (320° F.) to about 195° C. (383° F.).
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: January 30, 2007
    Assignee: Premix Inc.
    Inventor: Kurt I. Butler
  • Patent number: 6752937
    Abstract: The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising group II oxides, alkaline earth oxides, carbodiamides, polyisocynates, polyethylene and polytetraethylene fluoroethylene. The conductive filler is an inorganic filler which is desirably particulate graphite having a significant distribution of large particles such as for example, 95% in the range of about 150 to about 1000 microns with over about 40%, and more particularly about 50% or even 60% over 200 microns, or over 300 microns, or even over 600 microns. Conductive polymers may be used as a conductivity enhancer with the graphite. In addition, silver coated ceramic fibers can be added to improve the overall electrical properties. Fuel cell plates can be made from these compositions.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: June 22, 2004
    Assignee: Quantum Composites, Inc.
    Inventor: Kurt I. Butler
  • Publication number: 20030168638
    Abstract: The invention provides a resin matrix with high loadings of a conductive filler; various additional additives, such as initiators, mold-release agents, shrink control additives, and carbon black; and optionally one or more rheological agents selected from the group comprising group II oxides, alkaline earth oxides, carbodiamides, polyisocynates, polyethylene and polytetraethylene fluoroethylene. The conductive filler is an inorganic filler which is desirably particulate graphite having a significant distribution of large particles such as for example, 95% in the range of about 150 to about 1000 microns with over about 40%, and more particularly about 50% or even 60% over 200 microns, or over 300 microns, or even over 600 microns. Conductive polymers may be used as a conductivity enhancer with the graphite. In addition, silver coated ceramic fibers can be added to improve the overall electrical properties. Fuel cell plates can be made from these compositions.
    Type: Application
    Filed: April 29, 2002
    Publication date: September 11, 2003
    Inventor: Kurt I. Butler
  • Publication number: 20030042468
    Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by compression and/or injection molding techniques, into highly intricate and thin specimens without significant post machining. and which exhibit consistent conductivity, sufficient strength and flexibility, and appropriate surface characteristics. In particular the invention involves molding resin composition, which have high loadings of conductive fillers. Further the compositions may include rheological modifiers such as Group II oxides and hydroxides; carbodiamides; aziridines; polyisocyanates; polytetrafluorethylene (PTFE); perfluoropolyether (PFPE), and polyethylene. In an additional embodiment of the invention, an anti-shrink additive is added to improve the characteristics of the molded fuel cell plate.
    Type: Application
    Filed: March 27, 2002
    Publication date: March 6, 2003
    Applicant: QUANTUM COMPOSITES INC.
    Inventor: Kurt I. Butler
  • Patent number: 6436315
    Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by compression and/or injection molding techniques, into highly intricate and thin specimens without significant post machining. and which exhibit consistent conductivity, sufficient strength and flexibility, and appropriate surface characteristics. In particular the invention involves molding resin composition, which have high loadings of conductive fillers. Further the compositions may include rheological modifiers such as Group II oxides and hydroxides; carbodiamides; aziridines; polyisocyanates; polytetrafluorethylene (PTFE); perfluoropolyether (PFPE), and polyethylene. In an additional embodiment of the invention, an anti-shrink additive is added to improve the characteristics of the molded fuel cell plate.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: August 20, 2002
    Assignee: Quantum Composites Inc.
    Inventor: Kurt I. Butler
  • Patent number: 6365069
    Abstract: A technique and apparatus are disclosed for injection molding highly filled conductive resin compositions. These compositions include one or more of unsaturated polyester and vinyl ester resin; a copolymer having a terminal ethylene group; and at least about 50 weight percent of an inorganic particulate conductive filler, an initiator, and a rheological modifier to prevent phase separation between said resin and said conductive filler during molding. The method of the present invention allows these compositions to be molded into highly intricate and thin electrically and thermally conductive specimens without significant post process machining. The method involves the use of an injection molding apparatus that has a hopper with an auger having a vertical component in its positioning to feed into the feed throat of an injection molding machine which has a phenolic screw that has been modified to have a constant inner diameter and a constant flight depth.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: April 2, 2002
    Assignee: Quantum Composites Inc.
    Inventors: Kurt I. Butler, Daniel G. Thomas
  • Publication number: 20020005508
    Abstract: A technique and apparatus are disclosed for injection molding highly filled conductive resin compositions. These compositions include one or more of unsaturated polyester and vinyl ester resin; a copolymer having a terminal ethylene group; and at least about 50 weight percent of an inorganic particulate conductive filler, an initiator, and a rheological modifier to prevent phase separation between said resin and said conductive filler during molding. The method of the present invention allows these compositions to be molded into highly intricate and thin electrically and thermally conductive specimens without significant post process machining. The method involves the use of an injection molding apparatus that has a hopper with an auger having a vertical component in its positioning to feed into the feed throat of an injection molding machine which has a phenolic screw that has been modified to have a constant inner diameter and a constant flight depth.
    Type: Application
    Filed: June 12, 2001
    Publication date: January 17, 2002
    Inventors: Kurt I. Butler, Daniel G. Thomas
  • Publication number: 20010049046
    Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded such as by compression and/or injection molding techniques, into highly intricate and thin specimens without significant post machining. and which exhibit consistent conductivity, sufficient strength and flexibility, and appropriate surface characteristics. In particular the invention involves molding resin composition, which have high loadings of conductive fillers. Further the compositions may include rheological modifiers such as Group II oxides and hydroxides; carbodiamides; aziridines; polyisocyanates; polytetrafluorethylene (PTFE); perfluoropolyether (PFPE), and polyethylene. In an additional embodiment of the invention, an anti-shrink additive is added to improve the characteristics of the molded fuel cell plate.
    Type: Application
    Filed: May 4, 2001
    Publication date: December 6, 2001
    Inventor: Kurt I. Butler
  • Patent number: 6251308
    Abstract: A conductive polymer is disclosed which is suitable for use in applications which require corrosion resistance including resistance to corrosion when subjected to acidic flow at temperature ranging from −40 to 140 degrees Fahrenheit and which can be molded into highly intricate and thin specimens which exhibit consistent conductivity, sufficient strength and flexibility, and appropriate surface characteristics. In particular the invention involves molding unsaturated prepolymer resin composition which have high loadings of conductive fillers. Further to enable the necessary characteristics, the compositions include rheological modifiers such as Group II oxides and hydroxides; carbodiamides; aziridines; polyisocyanates; polytetrafluoroethylene (PTFE); perfluoropolyether (PFPE), and polyethylene.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: June 26, 2001
    Assignee: Premix
    Inventor: Kurt I. Butler