Patents by Inventor Kurt M. Striny

Kurt M. Striny has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip carrier package
    Patent number: 4642670
    Abstract: Described is an improved lead design for an integrated circuit chip carrier. The lead incorporates a U- or V-bend in the portion of the lead extending along the edge of the chip carrier to adapt the lead to either surface or socket mounting. The bend can also be used for locking the lead into the socket and, in conjunction with grooves in the sidewall of the chip carrier, for lead alignment retention.
    Type: Grant
    Filed: December 2, 1983
    Date of Patent: February 10, 1987
    Assignee: AT&T Bell Laboratories
    Inventor: Kurt M. Striny
  • Integrated circuit packages
    Patent number: H73
    Abstract: A package for wire-bonded semiconductor integrated circuit chips is disclosed. The chip is covered by a protective layer of material such as room temperature vulcanizing silicone rubber. The thickness of the layer is such that it covers a portion of the arched wires, thereby concentrating the stresses away from the wire-ball bond interfaces. The chip is encapsulated in a plastic material while providing an air gap between the plastic and protective layer.
    Type: Grant
    Filed: August 25, 1983
    Date of Patent: June 3, 1986
    Assignee: AT&T Bell Laboratories
    Inventors: Kenneth K. Claasen, Ronald N. Graver, Frank P. Pelletier, Kurt M. Striny, Ronald J. Wozniak