Patents by Inventor Kurt Matthew Critz

Kurt Matthew Critz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8114555
    Abstract: A method of manufacture includes an electrochemical cell structure having a first conductive member and a second conductive member. The first conductive member is spaced from the second conductive member. An adhesive is disposed between the first conductive member and the second conductive member. The adhesive has a solid state and a liquid state. The adhesive is liquefied to form a seal between the first conductive member and the second conductive member.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: February 14, 2012
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Andrei Leonida, Robert J. Roy, Kurt Matthew Critz
  • Publication number: 20110204022
    Abstract: A method of manufacture includes an electrochemical cell structure having a first conductive member and a second conductive member. The first conductive member is spaced from the second conductive member. An adhesive is disposed between the first conductive member and the second conductive member. The adhesive has a solid state and a liquid state. The adhesive is liquefied to form a seal between the first conductive member and the second conductive member.
    Type: Application
    Filed: April 29, 2011
    Publication date: August 25, 2011
    Inventors: Andrei Leonida, Robert J. Roy, Kurt Matthew Critz
  • Patent number: 7955751
    Abstract: An electrochemical cell has an anode cavity and a cathode cavity. The anode cavity and the cathode cavity sandwich an electrochemically conductive medium. The anode cavity and/or the cathode cavity have electrically conductive plates assembled using a solid bonding material. Each plate has nesting volumes and protrusions provided in the perimeter seal area. The protrusions of one plate fit into the volumes of an adjacent plate to eliminate the offset introduced by the bonding material thickness.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: June 7, 2011
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Andrei Leonida, Robert J. Roy, Kurt Matthew Critz