Patents by Inventor Kurt Michael Ulmer

Kurt Michael Ulmer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10643870
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 5, 2020
    Assignee: eLux Inc.
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 10431718
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: October 1, 2019
    Assignee: eLux Inc.
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20190273006
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: May 22, 2019
    Publication date: September 5, 2019
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 10347513
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: July 9, 2019
    Assignee: eLux Inc.
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20180309023
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Application
    Filed: July 2, 2018
    Publication date: October 25, 2018
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 10032957
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: July 24, 2018
    Assignee: eLux Inc.
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20180144957
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: January 1, 2018
    Publication date: May 24, 2018
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 9892944
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: February 13, 2018
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20180033915
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 1, 2018
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20180005998
    Abstract: Embodiments are related generally to electronic displays and, more particularly, to emissive displays made with transparent sheets having phosphor dots on the surface for the purpose of color conversion.
    Type: Application
    Filed: June 29, 2016
    Publication date: January 4, 2018
    Inventor: Kurt Michael Ulmer
  • Publication number: 20170372927
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: June 23, 2016
    Publication date: December 28, 2017
    Inventors: PAUL JOHN SCHUELE, DAVID ROBERT HEINE, MARK ALBERT CROWDER, SEAN MATHEW GARNER, CHANGQING ZHAN, AVINASH TUKARAM SHINDE, KENJI ALEXANDER SASAKI, KURT MICHAEL ULMER
  • Patent number: 9755110
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: September 5, 2017
    Assignee: SHARP LABORATORIES of AMERICA, INC.
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 9627437
    Abstract: Embodiments are related generally to display fabrication, and more particularly to a fluidic assembly process for the placement of light emitting diodes on a transparent display substrate.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: April 18, 2017
    Assignee: Sharp Laboratories of America, Inc.
    Inventors: Kurt Michael Ulmer, Paul John Schuele