Abstract: A method and system for adaptively controlling a laser-based material processing process are provided. The system includes sensing equipment to measure a process variable or condition of at least one of a laser-based material processing system and a workpiece processed by the material processing system and to provide a corresponding measurement signal. The control system also includes a signal processor for processing the measurement signal to obtain a processed signal which initiates, at least semi-automatically, an action associated with at least one of the material processing system and the workpiece. A method and system for at least semi-automatically qualifying a laser-based material processing system which delivers laser energy to locations on or adjacent a plurality of microstructures formed on a workpiece to at least partially process the microstructures are also provided.

Abstract: A method and system for adaptively controlling a laser-based material processing process are provided. The system includes sensing equipment to measure a process variable or condition of at least one of a laser-based material processing system and a workpiece processed by the material processing system and to provide a corresponding measurement signal. The control system also includes a signal processor for processing the measurement signal to obtain a processed signal which initiates, at least semi-automatically, an action associated with at least one of the material processing system and the workpiece. A method and system for at least semi-automatically qualifying a laser-based material processing system which delivers laser energy to locations on or adjacent a plurality of microstructures formed on a workpiece to at least partially process the microstructures are also provided.

Abstract: A reflective metrological scale has a metal tape substrate and a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of the substrate. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled and darkened to provide an enhanced optical reflection ratio with respect to surrounding surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating the substrate surface at a mark location with overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm2, and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.

Abstract: A laser processing system is disclosed for providing a relatively small velocity of a laser beam at target location while at least one scanner scans at a relatively larger velocity. The system includes a laser source, a first scanning unit, a beam expander, a second scanning unit and focusing optics. The laser source is for providing a pulsed laser output having at least one beam with a beam dimension. The first scanning unit is for scanning the laser output in a first direction along a first axis at the target location. The beam expander is for receiving the laser output and for modifying a beam diameter of the laser output and providing a modified laser output. The second scanning unit is for scanning the modified laser output from the beam expander in a second direction along the first axis at the target location.

Abstract: A laser processing system is disclosed for providing a relatively small velocity of a laser beam at target location while at least one scanner scans at a relatively larger velocity. The system includes a laser source, a first scanning unit, a beam expander, a second scanning unit and focusing optics. The laser source is for providing a pulsed laser output having at least one beam with a beam dimension. The first scanning unit is for scanning the laser output in a first direction along a first axis at the target location. The beam expander is for receiving the laser output and for modifying a beam diameter of the laser output and providing a modified laser output. The second scanning unit is for scanning the modified laser output from the beam expander in a second direction along the first axis at the target location.

Abstract: A method of fabricating a plurality of composite optical assemblies is disclosed. Each optical assembly includes a first optical element and a second optical element. The method includes the steps of providing a first composite substrate that may be divided into a plurality of first optical elements and forming on an exposed surface of the first composite substrate a second composite substrate that may be divided into a plurality of second optical elements, the first and second composite substrates providing a composite structure.

Abstract: A reflective metrological scale has a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of a substrate, which may be a nickel-based metal alloy such as Invar® or Inconel® and may be a thin and elongated flexible tape. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled or ridged and may be darkened to provide an enhanced optical reflection ratio with respect to surrounding reflective surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating a surface of the substrate at a mark location with a series of overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm2, and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.

Abstract: A method and system for adaptively controlling a laser-based material processing process are provided. The system includes sensing equipment to measure a process variable or condition of at least one of a laser-based material processing system and a workpiece processed by the material processing system and to provide a corresponding measurement signal. The control system also includes a signal processor for processing the measurement signal to obtain a processed signal which initiates, at least semi-automatically, an action associated with at least one of the material processing system and the workpiece. A method and system for at least semi-automatically qualifying a laser-based material processing system which delivers laser energy to locations on or adjacent a plurality of microstructures formed on a workpiece to at least partially process the microstructures are also provided.

Abstract: A method of fabricating a plurality of composite optical assemblies is disclosed. Each optical assembly includes a first optical element and a second optical element. The method includes the steps of providing a first composite substrate that may be divided into a plurality of first optical elements and forming on an exposed surface of the first composite substrate a second composite substrate that may be divided into a plurality of second optical elements, the first and second composite substrates providing a composite structure.

Abstract: A method of fabricating a plurality of composite optical assemblies is disclosed. Each optical assembly includes a first optical element and a second optical element. The method includes the steps of providing a first composite substrate that may be divided into a plurality of first optical elements and forming on an exposed surface of the first composite substrate a second composite substrate that may be divided into a plurality of second optical elements, the first and second composite substrates providing a composite structure.

Abstract: A method and apparatus for supporting a movable member (10) with respect to a fixed member (40) is provided. The movable member (10) includes a magnetically permeable portion (81) contained therein and magnetic element (50) fixedly attached thereto and movable therewith. The movable member (10) is supported for rotation with respect to the fixed member (40) by an outer bearing surface (11) of the movable member and an inner bearing surface (20) of the fixed member (40). The fixed member (40) provides access to the movable member (10) from two sides thereof. A magnetically permeable stator element (70) is fixedly attached to the fixed member (40) and positioned within a magnetic flux field of the magnetic element (50) such that an air gap (73) is formed between the magnetic element (50) and the stator element (70).

Abstract: A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of heights. A position measurement of a workpiece is obtained to be marked. Stored calibration data is associated with the position measurement. A method and system for calibrating a laser processing or marking system is provided. The method includes: calibrating a laser marker over a marking field; obtaining a position measurement of a workpiece to be marked; associating stored calibration data with the position measurement; relatively positioning a marking beam and the workpiece based on at least the associated calibration data; and calibrating a laser marking system in at least three degrees of freedom. The step of calibrating includes storing data corresponding to a plurality of positions and controllably and relatively positioning a marking beam based on the stored data corresponding to the plurality of positions.

Abstract: A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of heights. A position measurement of a workpiece is obtained to be marked. Stored calibration data is associated with the position measurement. A method and system for calibrating a laser processing or marking system is provided. The method includes: calibrating a laser marker over a marking field; obtaining a position measurement of a workpiece to be marked; associating stored calibration data with the position measurement; relatively positioning a marking beam and the workpiece based on at least the associated calibration data; and calibrating a laser marking system in at least three degrees of freedom. The step of calibrating includes storing data corresponding to a plurality of positions and controllably and relatively positioning a marking beam based on the stored data corresponding to the plurality of positions.

Abstract: Laser system and method for material processing with ultra fast lasers are provided. One aspect of the invention features the method which removes at least a portion of a target structure such as a memory link while avoiding undesirable damage to adjacent non-target structures. The method includes applying a single ultra short laser pulse to the target structure to remove the target structure with the single pulse.

Abstract: Laser system and method for material processing with ultra fast lasers are provided. One aspect of the invention features the method which removes at least a portion of a target structure such as a memory link while avoiding undesirable damage to adjacent non-target structures. The method includes applying a single ultra short laser pulse to the target structure to remove the target structure with the single pulse.

Abstract: A system for semiconductor wafer marking is provided. The system includes: (a) a first positioning subsystem for positioning a laser marking field relative to a wafer, the positioning along a first direction; (b) an alignment vision subsystem; (c) a laser marker including a laser for marking a location within the marking field with a laser marking beam; (d) a calibration program for calibrating at least one subsystem of the system; and (e) a controller. The marking field is substantially smaller than the wafer, and the laser marker includes a scan lens for optically maintaining a spot formed by the beam on the wafer within an acceptable range about the location within the marking field so as to avoid undesirable mark variations associated with wafer sag or other variations in depth within the field.

Abstract: The field portion (40) of a workpiece (14) that an electro-optical system (28) can image is deflected by a field-of-view deflector (38) and an array of light sources (42, 44) illuminates the workpiece. As the field of view (40) moves about the workpiece surface, individual sources (42, 44) in the light-source array are so turned on and off that all sources that could be imaged into the field of view by specular reflection are turned off. In this way, proper dark-field illumination is maintained.

Abstract: A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of heights. A position measurement of a workpiece is obtained to be marked. Stored calibration data is associated with the position measurement. A method and system for calibrating a laser processing or marking system is provided. The method includes: calibrating a laser marker over a marking field; obtaining a position measurement of a workpiece to be marked; associating stored calibration data with the position measurement; relatively positioning a marking beam and the workpiece based on at least the associated calibration data; and calibrating a laser marking system in at least three degrees of freedom. The step of calibrating includes storing data corresponding to a plurality of positions and controllably and relatively positioning a marking beam based on the stored data corresponding to the plurality of positions.

Abstract: The field portion (40) of a workpiece (14) that an electro-optical system (28) can image is deflected by a field-of-view deflector (38) and an array of light sources (42, 44) illuminates the workpiece. As the field of view (40) moves about the workpiece surface, individual sources (42, 44) in the light-source array are so turned on and off that all sources that could be imaged into the field of view by specular reflection are turned off. In this way, proper dark-field illumination is maintained.

Abstract: A method of fabricating a plurality of composite optical assemblies is disclosed. Each optical assembly includes a first optical element and a second optical element. The method includes the steps of providing a first composite substrate that may be divided into a plurality of first optical elements and forming on an exposed surface of the first composite substrate a second composite substrate that may be divided into a plurality of second optical elements, the first and second composite substrates providing a composite structure.