Patents by Inventor Kurt R. Goldhammer

Kurt R. Goldhammer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead wire array for a leadless chip carrier
    Patent number: 5177326
    Abstract: A lead wire array for a leadless chip carrier which functions to mount and electrically interconnect a leadless chip carrier to a printed wiring board. The array is formed from a length of bare wire which is appropriately folded and bent to provide interconnections between the contact pads on the leadless chip carrier and contact pads on the printed wiring board, which are then separated by removing portions of the lead wire array after its attachment to the leadless chip carrier.
    Type: Grant
    Filed: October 21, 1991
    Date of Patent: January 5, 1993
    Assignee: GEC-Marconi Electronic Systems Corp.
    Inventor: Kurt R. Goldhammer
  • Hybrid module electronics package
    Patent number: 4996630
    Abstract: A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.
    Type: Grant
    Filed: September 27, 1989
    Date of Patent: February 26, 1991
    Assignee: Plessey Electronic Systems Corp.
    Inventors: Ralph Liguori, Kurt R. Goldhammer, Lothar Laermer
  • Hybrid module electronics package
    Patent number: RE34291
    Abstract: A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.
    Type: Grant
    Filed: May 18, 1992
    Date of Patent: June 22, 1993
    Assignee: GEC-Marconi Electronic Systems Corp.
    Inventors: Ralph Liguori, Kurt R. Goldhammer, Lothar Laermer