Patents by Inventor Kurt Rasmussen
Kurt Rasmussen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240133736Abstract: Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Inventors: Pirmin Rombach, Kurt Rasmussen, Dennis Mortensen, Jan Ravnkilde, Cheng-Yen Liu, Jotaro Akiyama, Sushil Bharatan, Troy Chase
-
Publication number: 20230356998Abstract: In an embodiment, a method for fabricating a Microelectromechanical System (MEMS) microphone includes depositing, on a frontside of a wafer, a first oxide layer over a silicon nitride thin film and over and adjacent the wafer, wherein the silicon nitride thin film is disposed over the wafer, depositing a membrane protection layer over the first oxide layer between a first side of a first cavity formed in the wafer and a second side of a second cavity formed in the wafer, depositing a second oxide layer over and adjacent the membrane protection layer, depositing a first membrane nitride layer over the second oxide layer, depositing a membrane polysilicon layer over the first membrane nitride layer, depositing a second membrane nitride layer over the membrane polysilicon layer, depositing a third oxide layer over the second membrane nitride layer and depositing a fourth oxide layer over the third oxide layer.Type: ApplicationFiled: July 24, 2023Publication date: November 9, 2023Inventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu, Morten Ginnerup, Jan Tue Ravnkilde, Jotaro Akiyama
-
Patent number: 11746001Abstract: A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.Type: GrantFiled: May 5, 2021Date of Patent: September 5, 2023Assignees: TDK Electronics AG, TDK CorporationInventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu, Morten Ginnerup, Jan Tue Ravnkilde, Jotaro Akiyama
-
Publication number: 20230118429Abstract: A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that includes a first lateral etch stop that includes a first corner radius and a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.Type: ApplicationFiled: December 20, 2022Publication date: April 20, 2023Inventors: Pirmin Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu, Morten Ginnerup, Jan Ravnkilde, Jotaro Akiyama
-
Patent number: 11388496Abstract: Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a substrate defining a first opening to receive a pressure wave. The microelectromechanical microphone device also can include a flexible plate mechanically coupled to the substrate and a rigid plate mechanically coupled to the flexible plate. The flexible plate is deformable by the pressure wave. The rigid plate defines multiple openings that permit passage of the pressure wave. The microelectromechanical microphone device can further include at least one stoppage member assembled in a spatial relationship with the flexible plate. The at least one stoppage member can limit motion of the flexible plate in response to the pressure wave including a threshold amplitude.Type: GrantFiled: February 16, 2021Date of Patent: July 12, 2022Assignee: TDK CORPORATIONInventors: Pirmin Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu
-
Patent number: 11365119Abstract: In an embodiment a device includes a substrate including an upper substrate surface and a lower substrate surface and a membrane-layer suspended above the upper substrate surface, wherein the substrate includes a recess penetrating the substrate between the lower substrate surface and the upper substrate surface, wherein the membrane-layer spans the recess, wherein the recess includes an upper recess region, an intermediate recess region, and a lower recess region, wherein the upper recess region is a part of the recess in direct vicinity to the upper substrate surface, the intermediate recess region is a part of the recess directly below the upper recess region, and the lower recess region is a part of the recess other than the upper recess region and the intermediate recess region, and wherein a cross-sectional area of the upper recess region determined parallel to the upper substrate surface is larger than a respective cross-sectional area of the intermediate recess region.Type: GrantFiled: January 14, 2021Date of Patent: June 21, 2022Assignee: TDK CORPORATIONInventor: Kurt Rasmussen
-
Patent number: 11214483Abstract: In an embodiment a MEMS microphone includes a substrate, a shield layer, a central insulation layer and a membrane, wherein the substrate has an upper surface with a first opening therein, wherein the shield layer is arranged between the upper surface of the substrate and the membrane, the shield layer having a second opening, wherein the central insulation layer is arranged between the shield layer and the membrane, the shield layer comprising a dielectric bulk material having a third opening and an etch stopper forming an edge of the central insulation layer towards the third opening such that the dielectric bulk material of the central insulation layer is completely enclosed between the shield layer, the etch stopper and the membrane, and wherein all openings are arranged one above another to form a common sound channel to the membrane.Type: GrantFiled: October 23, 2020Date of Patent: January 4, 2022Assignee: TDK CORPORATIONInventors: Kurt Rasmussen, Jan Tue Ravnkilde
-
Publication number: 20210347635Abstract: A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.Type: ApplicationFiled: May 5, 2021Publication date: November 11, 2021Inventors: Pirmin Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu, Morten Ginnerup, Jan Ravnkilde, Jotaro Akiyama
-
Publication number: 20210300753Abstract: In an embodiment a device includes a substrate including an upper substrate surface and a lower substrate surface and a membrane-layer suspended above the upper substrate surface, wherein the substrate includes a recess penetrating the substrate between the lower substrate surface and the upper substrate surface, wherein the membrane-layer spans the recess, wherein the recess includes an upper recess region, an intermediate recess region, and a lower recess region, wherein the upper recess region is a part of the recess in direct vicinity to the upper substrate surface, the intermediate recess region is a part of the recess directly below the upper recess region, and the lower recess region is a part of the recess other than the upper recess region and the intermediate recess region, and wherein a cross-sectional area of the upper recess region determined parallel to the upper substrate surface is larger than a respective cross-sectional area of the intermediate recess region.Type: ApplicationFiled: January 14, 2021Publication date: September 30, 2021Inventor: Kurt Rasmussen
-
Publication number: 20210306727Abstract: Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a substrate defining a first opening to receive a pressure wave. The microelectromechanical microphone device also can include a flexible plate mechanically coupled to the substrate and a rigid plate mechanically coupled to the flexible plate. The flexible plate is deformable by the pressure wave. The rigid plate defines multiple openings that permit passage of the pressure wave. The microelectromechanical microphone device can further include at least one stoppage member assembled in a spatial relationship with the flexible plate. The at least one stoppage member can limit motion of the flexible plate in response to the pressure wave including a threshold amplitude.Type: ApplicationFiled: February 16, 2021Publication date: September 30, 2021Inventors: Pirmin Rombach, Kurt Rasmussen, Dennis Mortensen, Cheng-Yen Liu
-
Patent number: 11128959Abstract: A MEMS microphone including a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip includes a bulk material with an aperture covered and closed by a mesh. The mesh includes a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.Type: GrantFiled: July 3, 2018Date of Patent: September 21, 2021Assignee: TDK CorporationInventors: Pirmin Hermann Otto Rombach, Dennis Mortensen, Jan Tue Ravnkilde, Kurt Rasmussen, Morten Ginnerup
-
Publication number: 20210122626Abstract: In an embodiment a MEMS microphone includes a substrate, a shield layer, a central insulation layer and a membrane, wherein the substrate has an upper surface with a first opening therein, wherein the shield layer is arranged between the upper surface of the substrate and the membrane, the shield layer having a second opening, wherein the central insulation layer is arranged between the shield layer and the membrane, the shield layer comprising a dielectric bulk material having a third opening and an etch stopper forming an edge of the central insulation layer towards the third opening such that the dielectric bulk material of the central insulation layer is completely enclosed between the shield layer, the etch stopper and the membrane, and wherein all openings are arranged one above another to form a common sound channel to the membrane.Type: ApplicationFiled: October 23, 2020Publication date: April 29, 2021Inventors: Kurt Rasmussen, Jan Tue Ravnkilde
-
Patent number: 10683201Abstract: A MEMS device having a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.Type: GrantFiled: September 30, 2015Date of Patent: June 16, 2020Assignee: TDK CorporationInventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Anton Leidl, Wolfgang Pahl, Dennis Mortensen
-
Publication number: 20200169818Abstract: A MEMS microphone is provided comprising a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip comprises a bulk material with an aperture covered and closed by a mesh. The mesh comprises a layer of the filter chip with parallel through-going first holes structured in the layer. The filter chip is arranged in or on the carrier board such that the mesh covers the sound opening.Type: ApplicationFiled: July 3, 2018Publication date: May 28, 2020Inventors: Pirmin Hermann Otto Rombach, Dennis Mortensen, Jan Tue Ravnkilde, Kurt Rasmussen, Morten Ginnerup
-
Patent number: 10499161Abstract: A microphone and a method for manufacturing a microphone are disclosed. In an embodiment the microphone includes a substrate, a transducer element defining a front volume and a lid arranged such that the transducer element is arranged between the substrate and the lid, wherein the lid comprises an opening which is arranged non-overlapping to the front volume of the transducer element. The microphone further includes an insert arranged between the lid and the transducer element, wherein the insert includes a path which connects the front volume of the transducer element to the opening of the lid.Type: GrantFiled: June 23, 2014Date of Patent: December 3, 2019Assignee: TDK CORPORATIONInventor: Kurt Rasmussen
-
Patent number: 10194251Abstract: A package for a top port microphone with an enlarged back volume. The package includes on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.Type: GrantFiled: October 7, 2015Date of Patent: January 29, 2019Assignee: TDK CorporationInventors: Morten Ginnerup, Pirmin Hermann Otto Rombach, Jan Tue Ravnkilde, Dennis Mortensen, Kurt Rasmussen
-
Patent number: 10136226Abstract: A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.Type: GrantFiled: December 18, 2012Date of Patent: November 20, 2018Assignee: TDK CORPORATIONInventors: Jan Tue Ravnkilde, Marcel Giesen, Kurt Rasmussen, Morten Ginnerup, Pirmin Hermann Otto Rombach, Wolfgang Pahl, Anton Leidl, Armin Schober, Jürgen Portmann
-
Publication number: 20180302725Abstract: A package for a top port microphone with an enlarged back volume comprises on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.Type: ApplicationFiled: October 7, 2015Publication date: October 18, 2018Inventors: Morten Ginnerup, Pirmin Hermann Otto Rombach, Jan Tue Ravnkilde, Dennis Mortensen, Kurt Rasmussen
-
Publication number: 20180244515Abstract: A MEMS device comprises a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.Type: ApplicationFiled: September 30, 2015Publication date: August 30, 2018Inventors: Pirmin Hermann Otto Rombach, Kurt Rasmussen, Anton Leidl, Wolfgang Pahl, Dennis Mortensen
-
Patent number: 9980052Abstract: A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate.Type: GrantFiled: November 14, 2011Date of Patent: May 22, 2018Assignee: TDK CORPORATIONInventors: Leif Steen Johansen, Jan Tue Ravnkilde, Pirmin Hermann Otto Rombach, Kurt Rasmussen