Patents by Inventor Kurt Sakamoto

Kurt Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor component and semiconductor component thereof
    Patent number: 6387768
    Abstract: A method of manufacturing a semiconductor component includes providing a substrate (110), an electrically insulative layer (710 or 810) over the substrate, and an electrically conductive layer (820) over the electrically insulative layer. A hole (1510) is etched into a portion (910) of the electrically conductive layer and into a portion of the electrically insulative layer. Another electrically conductive layer (1710) is deposited in the hole, and the two electrically conductive layers are etched to leave a portion (1810) of the second electrically conductive layer in the hole. Then, an additional electrically conductive layer (1910) is grown over the substrate and over the portion of the second electrically conductive layer.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: May 14, 2002
    Assignee: Semiconductor Components Industries LLC
    Inventor: Kurt Sakamoto