Abstract: Risers including a plurality of high aspect ratio electrical conduits, as well as systems and methods of manufacture and/or use of the risers and/or the high aspect ratio electrical conduits. The systems and methods may include incorporation of the plurality of high aspect ratio electrical conduits within a substantially planar body that may include and/or be formed from a solid dielectric material. The plurality of electrical conduits may be configured to conduct a plurality of electric currents between a first surface of the body and a second, substantially opposed, surface of the body. The surfaces may include a plurality of contact pads configured to provide a robust and/or corrosion-resistant surface and/or to improve electrical contact between the riser and another device. The risers also may include a layered structure, wherein the layers are sequentially formed to increase a thickness of the riser and/or the aspect ratio of the electrical conduits.

Abstract: A composite photoresist comprises a photoresist material and a filler material dispersed within the photoresist material, wherein the filler material includes a plurality of nanoparticles. The photoresist material may comprise an acrylic-based photoresist, a novolak-based photoresist, a polyhydroxystyrene-based photoresist, a SLAM, or a BARC. The filler material may comprise base-soluble styrene-butadiene rubber nanospheres, nitrile-butadiene rubber nanospheres, polystyrene-based nanoparticles, acrylic-based nanoparticles, or inorganic nanoparticles. The nanoparticles may have an average diameter that is between around 10 nm and around 1000 nm and may have a loading in the photoresist material that is between around 5% and 50%. The composite photoresist may be used to form die-side metal bumps for use in a C4 connection that have a roughened sidewall surface but a smooth top surface.

Abstract: A composite photoresist comprises a photoresist material and a filler material dispersed within the photoresist material, wherein the filler material includes a plurality of nanoparticles. The photoresist material may comprise an acrylic-based photoresist, a novolak-based photoresist, a polyhydroxystyrene-based photoresist, a SLAM, or a BARC. The filler material may comprise base-soluble styrene-butadiene rubber nanospheres, nitrile-butadiene rubber nanospheres, polystyrene-based nanoparticles, acrylic-based nanoparticles, or inorganic nanoparticles. The nanoparticles may have an average diameter that is between around 10 nm and around 1000 nm and may have a loading in the photoresist material that is between around 5% and 50%. The composite photoresist may be used to form die-side metal bumps for use in a C4 connection that have a roughened sidewall surface but a smooth top surface.

Abstract: Embodiments of the invention include apparatuses and methods relating to die-side bumps having a tapered cross-section. In one embodiment, the tapered die-side bump is electrically coupled to a solder bump on a package substrate.

Abstract: A device (10) for testing miniature electronic components (104) includes a pair of contacts (88, 90), each of which is adapted to engage a common side (121) of a lead (110) of the electronic component (104) to be tested at longitudinally spaced locations. In particular, each contact (88, 90) includes an end portion (95, 99) that is arranged at an angle to both the lead (110) and the other contact (88, 90), while extending in a common vertical plane with the other contact (88, 90). In a preferred form of the invention, the device (10) includes a base (46) to which the first and second contacts (88, 90) are mounted. Each of the contacts (88, 90) include first and second end portions (94, 95 and 98, 99), with the first end portion (94, 98) of each contact (88, 90) being fixed relative to the base (46) and the second end portion (95, 99) extending at an angle to a plane of the base (46).