Abstract: In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film structures and is imprinted with corresponding conductor paths having contact faces, the ceramic substrate is to be connected with a second circuit plane composed of a green tape substrate.

Abstract: The high pressure sensor includes a housing part, a lid closing the same and an intermediary disposed sensor disk. A cylindrical pressure chamber is formed in the housing, wherein an inner area of the sensor disk is disposed in a sealed off manner. In this area the measuring sensors are disposed in form of piezoresistive layer resistors. Layer conductors penetrate from this inner area into an outer area, wherein evaluation circuits and the evaluation electronic are disposed. The total sensor disk is provided with one or a plurality of glass layers in such a manner that a flat surface is obtained. Pressure changes of the pressure medium are picked up in the pressure chamber by the measuring sensors and are processed accordingly. Such a high pressure sensor is relatively simple and advantageous in its use.

Abstract: A pressure measuring element includes a plate-shaped substrate of ceramic material and a membrane deformable in response to pressure fluctuations. The membrane is made of ceramic material and is mounted to the upper side of the substrate. A pressure-sensitive resistor for measuring pressure is positioned inside the membrane. A heating resistor element is positioned on the underside of the substrate, which maintains the temperature of the substrate constant. A temperature sensor is also arrayed on the upper side of the substrate near the membrane.

Abstract: Very fine solder-coated conduction paths are made on ceramic, glass or enamel substrates by the combination of a first step in thick-film technology followed by the photo-masking and etching steps typical of thin-film technology, after which galvanic reinforcement of the initial calcined copper paste layer is performed in the locations where the initial layer is exposed by the developed mask. A lead-tin solder layer is then galvanically deposited, which is thicker than the mask, after which the mask is removed and the newly exposed portions of the initial copper layer are etched away. A reflow treatment of the solder layer pattern consolidates the solder layer by melting on top of the boundaries of the unetched initial copper layer. It is possible to obtain conduction path spacings down to 50 .mu.m with conduction paths coated with solder that have excellent adhesion to ceramic, glass or enamel substrates.

Abstract: A deformable membrane is made by applying, by thick-film technology, a glass-ceramic paste over a vaporizable or burnable filler material, containing primarily carbon black in a binder which, in turn, is located on a substrate, for example of ceramic, glass, enameled metal or the like. The substrate for example is about 1.5 cm square, the membrane glass ceramic being applied as a circular dot of about 0.5 cm diameter. After solidifying the paste forming the membrane in a protective gas atmosphere, for example at about 950.degree. C., the filler is burned out in an oxidizing atmosphere, to escape through pores in the membrane material. By selecting a membrane material which has a lower thermal coefficient of expansion than that of the substrate, after burning, the membrane will assume a convex shape leaving a hollow space (8) beneath it and the substrate.