Abstract: A car floor for an elevator car includes a planar base part and installation feet arranged thereon. The installation feet support the car floor on the shaft floor of an elevator shaft during the elevator car installation phase. In order to orient the base part in a horizontal position, each of the installation feet is in the form of a height-adjustable installation foot. The height-adjustable installation foot has a threaded rod as part of a threaded spindle for height adjustment.

Abstract: Embodiments described herein may provide a temperature-compensated surface acoustic wave (TCSAW) device, a method of fabricating a TCSAW device, and a system incorporating a TCSAW device. The TCSAW device may include a pyroelectric substrate, a plurality of electrodes formed on a first surface of the pyroelectric substrate, an amorphous silicon layer formed over the plurality of electrodes, and a temperature compensating layer formed over the amorphous silicon layer.

Abstract: Embodiments described herein may provide a temperature-compensated surface acoustic wave (TCSAW) device, a method of fabricating a TCSAW device, and a system incorporating a TCSAW device. The TCSAW device may include a pyroelectric substrate, a plurality of electrodes formed on a first surface of the pyroelectric substrate, an amorphous silicon layer formed over the plurality of electrodes, and a temperature compensating layer formed over the amorphous silicon layer.

Abstract: Embodiments described herein may provide an acoustic wave device, a method of fabricating an acoustic wave device, and a system incorporating an acoustic wave device. The acoustic wave device may include a transducer disposed on a substrate, with a contact coupled with the transducer. The acoustic wave device may further include a wall layer and cap that define an enclosed opening around the transducer. A via may be disposed through the cap and wall layer over the contact, and a top metal may be disposed in the via. The top metal may form a pillar in the via and a pad on the cap above the via. The pillar may provide an electrical connection between the pad and the contact. In some embodiments, the acoustic wave device may be formed as a wafer-level package on a substrate wafer.

Abstract: Disclosed embodiments include a surface acoustic wave device having electrode period, electrode width, and/or ratio of electrode width to electrode period varied in a prescribed manner.

Abstract: Disclosed embodiments include a surface acoustic wave device having electrode period, electrode width, and/or ratio of electrode width to electrode period varied in a prescribed manner.

Abstract: The apparatus (1) which combines a heat exchange between a liquid (8) and a heat transporting medium (7) with a static mixing of the liquid includes installed structures (2) in a jacket (3). The jacket extends longitudinally between a head end (4) and a base end (5). The installed structures form a heat exchanging and mixing structure. The heat transporting medium can be conveyed from the base end to the head end as an inner flow in tubes (21, 22) of the installed structures. The liquid can be conveyed from the head end to the base end as an outer flow. Reinforcement elements (6, 6?, 6?) are provided which stabilise the installed structures in the longitudinal direction against pressure gradients generated by the liquid. The installed structures are connected by the reinforcement elements to form a non-expandable part structure (2a) in a main region; they remain at least partly non-reinforced as a longitudinally expandable part structure (2b) and in a secondary region complementary to the main region.

Abstract: The apparatus (1) which combines a heat exchange between a liquid (8) and a heat transporting medium (7) with a static mixing of the liquid includes installed structures (2) in a jacket (3). The jacket extends longitudinally between a head end (4) and a base end (5). The installed structures form a heat exchanging and mixing structure. The heat transporting medium can be conveyed from the base end to the head end as an inner flow in tubes (21, 22) of the installed structures. The liquid can be conveyed from the head end to the base end as an outer flow. Reinforcement elements (6, 6?, 6?) are provided which stabilise the installed structures in the longitudinal direction against pressure gradients generated by the liquid. The installed structures are connected by the reinforcement elements to form a non-expandable part structure (2a) in a main region; they remain at least partly non-reinforced as a longitudinally expandable part structure (2b) and in a secondary region complementary to the main region.

Abstract: The present invention provides a solder bump structure. In one aspect, the solder bump structure is utilized in a semiconductor device, such as an integrated circuit. The semiconductor device comprises active devices located over a semiconductor substrate, interconnect layers comprising copper formed over the active devices, and an outermost metallization layer positioned over the interconnect layers. The outermost metallization layer comprises aluminum and includes at least one bond pad and at least one interconnect runner each electrically connected to an interconnect layer. An under bump metallization layer (UBM) is located over the bond pad, and a solder bump is located over the UBM.

Abstract: A protruding spacer that protrudes above the top surface of a gate electrode structure provides enhanced resistance to exposure of the gate electrode during the etch process used to form self-aligned contacts. The protruding spacer may be formed using an amorphous carbon sacrificial layer as the top layer of the patterned gate electrode structure. Dielectric spacers are formed alongside the gate electrode structure, including alongside the sacrificial amorphous carbon layer. The dielectric spacers extend substantially to the top of the amorphous carbon layer. The amorphous carbon layer is then removed such that the remaining gate structure includes dielectric spacers that have a protruding section that protrudes above the top surface of the remaining gate structure. A nitride layer may be formed over the gate structure. Such a structure prevents exposure of the gate electrode during the formation of self-aligned contacts, and shorting, once the contact openings are filled.

Abstract: An inductor formed within an integrated circuit and a method for forming the inductor. The inductor comprises an underlying layer of aluminum formed in a first metallization layer and patterned and etched into the desired shape. In one embodiment the aluminum line comprises a spiral shape. According to a damascene process, a conductive runner, preferably of copper, is formed in a dielectric layer overlying the aluminum line and in electrical contact therewith. The aluminum line and the conductive runner cooperate to form the inductor. In another embodiment the aluminum line and the conductive runner are formed in a vertically spaced-apart orientation, with tungsten plugs or conductive vias formed to provide electrical connection therebetween. A method for forming the inductor comprises forming an aluminum conductive line and forming a conductive runner over the conductive line.

Abstract: An inductor formed within an integrated circuit and a method for forming the inductor. The inductor comprises an underlying layer of aluminum formed in a first metallization layer and patterned and etched into the desired shape. In one embodiment the aluminum line comprises a spiral shape. According to a damascene process, a conductive runner, preferably of copper, is formed in a dielectric layer overlying the aluminum line and in electrical contact therewith. The aluminum line and the conductive runner cooperate to form the inductor. In another embodiment the aluminum line and the conductive runner are formed in a vertically spaced-apart orientation, with tungsten plugs or conductive vias formed to provide electrical connection therebetween. A method for forming the inductor comprises forming an aluminum conductive line and forming a conductive runner over the conductive line.

Abstract: Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.

Abstract: A method of conducting crash tests uses a crash-test carriage. The crash-test carriage is accelerated in accordance with a real deceleration curve to thereby simulate deceleration forces associated with a real collision, the crash-test carriage having a carriage drive apparatus associated therewith. The method includes the step of exerting an accelerating force on the crash-test carriage in an acceleration direction, the accelerating force exceeding a respective force required for acceleration in accordance with the real deceleration curve. The method also includes a step of exerting a braking force on the crash-test carriage in a direction opposite the acceleration direction in order to achieve a desired acceleration curve. The braking force is applied on one of the crash-test carriage and the carriage drive apparatus, the braking force being so large so as to accelerate the crash-test carriage in accordance with the desired acceleration curve.

Abstract: A process for producing pulverous, i.e., powdered, preparations from sparingly soluble solid materials is disclosed. The process utilizes dimethyl ether under conditions of elevated temperature and pressure to dissolve the solid material. Upon release of the pressure, the solid material precipitates as a fine powder and the gaseous dimethyl ether is released or drawn off.

Abstract: A process for producing pulverous, i.e., powdered, preparations from sparingly soluble solid materials is disclosed. The process utilizes dimethyl ether under conditions of elevated temperature and pressure to dissolve the solid material. Upon release of the pressure, the solid material precipitates as a fine powder and the gaseous dimethyl ether is released or drawn off.

Abstract: A process for producing pulverous, i.e., powdered, preparations from sparingly soluble solid materials is disclosed. The process utilizes dimethyl ether under conditions of elevated temperature and pressure to dissolve the solid material. Upon release of the pressure, the solid material precipitates as a fine powder and the gaseous dimethyl ether is released or drawn off.

Abstract: A turboprop engine in the pod of which an air-oil cooler is disposed downstream of a cooling air inlet opening. The oil cooler exhaust air is discharged via an air duct with which a cooling air conveying device is associated. In this way it is ensured that there is always a sufficient cooling air flow and that this air flow, as a relatively cold air flow, can also cool other units in the engine pod before acting on the oil cooler.

Abstract: A process for the manufacture of 4H-imidazo?1,5-a!?1,4!benzodiazepine derivatives of formula I ##STR1## wherein R.sup.1 is phenyl or mono- or disubstituted phenyl;R.sup.2 is hydrogen, halogen, nitro, cyano, trifluoromethyl or lower alkyl;R.sup.3 is hydrogen or lower alkyl; andR.sup.4 is hydrogen or lower alkyland of pharmaceutically usable salts of these compounds by decarboxylating a 4H-imidazo?1,5-a!?1,4!benzodiazepinecarboxylic acid of formula II ##STR2## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 have the above significances, at elevated temperature and under elevated pressure in the presence of an organic solvent. The compounds of formula I and their pharmaceutically usable acid addition salts are known muscle relaxants, sedatives and anticonvulsants.

Abstract: A process is described for the manufacture of .beta.-ionone by the sulphuric acid-catalyzed cyclization of pseudoionone in a two-phase solvent system comprising concentrated sulphuric acid and a second solvent essentially immiscible with water, which process comprises using carbon dioxide liquefied under pressure as the second solvent. This process is carried out, inter alia, under a pressure of about 50 bar to about 150 bar and at temperatures from about -15.degree. C. to about +15.degree. C. prior to the subsequent stopping (quenching) of the cyclization reaction. The process in accordance with the invention is preferably carried out continuously and is an important intermediate stage in the synthesis of vitamin A.