Abstract: Ethylene polymer compositions comprising a high molecular weight high density polyethylene resin and a low density polyethylene resin are disclosed, where the polymer composition has a comparatively high melt strength for a given melt index. The compositions comprise from 25 to 99 percent by weight of the composition of a linear or substantially linear polyethylene polymer having a density of at least about 0.90 g/cc, and an I21 of less than about 20; and from 1 to 25 percent by weight of the composition of a high pressure low density type polyethylene resin having a melt index (I2) less than about 5, a molecular weight distribution greater than about 10, a Mw_abs/Mw_gpc ratio (“Gr”) of at least 2.7, and a melt strength at 190° C. greater than 19.0?12.6*log10(Mi). The compositions of the present invention are particularly well suited for blown film and thermoforming applications.

Abstract: Polymer blends are disclosed that include from about 5 percent (by weight of the total composition) to about 95 percent (by weight of the total composition) of at least one first ethylene interpolymer having at least one first comonomer, and from about 95 percent (by weight of the total composition) to about 5 percent (by weight of the total composition) of at least one second ethylene interpolymer having at least one second comonomer. In the disclosed blends, the first comonomer is different from the second comonomer and the melt index (I2) of the first ethylene interpolymer is less than or equal to the melt index (I2) of the second ethylene interpolymer. The blend are also characterized as having a density of greater than or equal to 0.90 g/cc. Articles made from such blends are also disclosed.