Patents by Inventor Kurt Williamson Eisenbeiser

Kurt Williamson Eisenbeiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7067856
    Abstract: High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: June 27, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jamal Ramdani, Ravindranath Droopad, Lyndee L. Hilt, Kurt Williamson Eisenbeiser