Patents by Inventor Kurumi Miyake

Kurumi Miyake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring panel including wiring having a surface-reforming layer and method for producing the same
    Patent number: 5175399
    Abstract: Disclosed herein is a wiring panel constructed with a substrate; an electrically conductive member laminated on the substrate and principally composed of copper; and an insulating member composed of an organic substance, wherein a very small amount of a non-metallic element is incorporated into the electrically conductive member, and a very small amount of a metal element is incorporated into the insulating member.Also disclosed herein is a method for producing a wiring panel constructed with a substrate, an electrically conductive member provided on the substrate and composed of copper as the principal constituent, and an insulating layer of an organic substance covering the conductive member, which comprises steps of: applying onto the surface of the electrically conductive member a surface-reforming layer which functions to suppress electron transfer through the surface of the electrically conductive member, and thereafter forming the organic insulating layer on the electrically conductive member.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: December 29, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Mitsumasa Mori, Eishi Gofuku, Mitsuyuki Takada, Kurumi Miyake, Yoshiyuki Morihiro, Masanobu Kohara