Patents by Inventor Kusuma S. Seelin

Kusuma S. Seelin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5713666
    Abstract: A method and apparatus for measuring thermal properties of electronic components (25) encapsulated in packaging is described. The method can be used to measure a junction temperature T.sub.j of the electronic component (25), without removing the package (30), and during operation of the electronic component (25) by a power supply.
    Type: Grant
    Filed: August 30, 1995
    Date of Patent: February 3, 1998
    Assignee: Seelink Technology
    Inventors: Kusuma S. Seelin, Srikanth N. Seelin