Patents by Inventor Kwadwo Tettey

Kwadwo Tettey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith
    Patent number: 11772230
    Abstract: The present invention provides CMP polishing pads or layers having a unfilled Shore D (2 second) hardness of from 57-77 or a filled Shore D (2 second) hardness of from 18-50, made from a two-component reaction mixture of (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer having an unreacted isocyanate (NCO) concentration of from 18 to 47 wt. %, based on the total solids weight of the aromatic isocyanate component, and (ii) a liquid polyol component including one or more curatives selected from the group of amines defined by Formulas (I) and (II).
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: October 3, 2023
    Assignee: Rohm and Haas Electronic Materials CMP Holdings Inc.
    Inventors: Jing Ren, Kwadwo Tettey, Bryan E. Barton
  • SURFACE MODIFIED SILANIZED COLLOIDAL SILICA PARTICLES
    Publication number: 20220356065
    Abstract: Modified silanized colloidal silica particles are reaction products of silanized colloidal silica particles having epoxy moieties with a nitrogen of an amino group of an amino acid to form stable modified silanized colloidal silica particles. The modified silanized colloidal silica particles can be used as an abrasive in chemical mechanical polishing of various substrates.
    Type: Application
    Filed: March 17, 2022
    Publication date: November 10, 2022
    Inventors: Changzai Chi, Murali Ganth Theivanayagam, Kwadwo Tettey
  • CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD
    Publication number: 20220348790
    Abstract: Chemical mechanical polishing compositions include modified silanized colloidal silica particles which are reaction products of silanized colloidal silica particles having epoxy moieties with nitrogen of amines to form stable and tunable modified silanized colloidal silica particles. The modified silanized colloidal silica particles can be used as an abrasive in chemical mechanical polishing of various substrates to polish metal such as copper, Ta and TaN and dielectrics such as TEOS and low-K film.
    Type: Application
    Filed: March 17, 2022
    Publication date: November 3, 2022
    Inventors: Changzai Chi, Kwadwo Tettey, Matthew Richard Van Hanehem, Murali Ganth Theivanayagam, Li Zhang, David Wayne Mosley
  • FORMULATIONS FOR HIGH POROSITY CHEMICAL MECHANICAL POLISHING PADS WITH HIGH HARDNESS AND CMP PADS MADE THEREWITH
    Publication number: 20220226960
    Abstract: The present invention provides CMP polishing pads or layers having a unfilled Shore D (2 second) hardness of from 57-77 or a filled Shore D (2 second) hardness of from 18-50, made from a two-component reaction mixture of (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer having an unreacted isocyanate (NCO) concentration of from 18 to 47 wt. %, based on the total solids weight of the aromatic isocyanate component, and (ii) a liquid polyol component including one or more curatives selected from the group of amines defined by Formulas (I) and (II).
    Type: Application
    Filed: January 21, 2021
    Publication date: July 21, 2022
    Inventors: Jing Ren, Kwadwo Tettey, Bryan E. Barton