Abstract: An electrode assembly includes a radical unit in which electrodes and separators are alternately stacked, the radical unit having a structure in which one electrode is stacked at the uppermost end. An auxiliary unit is provided with a separation sheet disposed at the uppermost end side of the radical unit. The separation sheet includes a separation part disposed at the uppermost end side of the radical unit and a side surface protection part connected to each of side surfaces of the separation part and folded to contact a side portion of the radical unit to cover the side portion of the radical unit.

Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.

Abstract: Provided is a recycling method of recovery oil including: a) recovering sludge accumulated in a crude oil tank; b) separating the sludge into recovery oil, water, and sediment; and c) mixing the recovery oil with crude oil and performing fractional distillation on a mixture of the recovery oil and the crude oil.

Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.