Patents by Inventor Kwan Bum LEE

Kwan Bum LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation printed circuit board and manufacturing method thereof
    Patent number: 9609737
    Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: March 28, 2017
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, YURA CORPORATION CO., LTD.
    Inventors: Mun Jong Kim, Kwan Bum Lee, Jin Su Yeom
  • Recycling Method of Sludge Recovery Oil
    Publication number: 20150353846
    Abstract: Provided is a recycling method of recovery oil including: a) recovering sludge accumulated in a crude oil tank; b) separating the sludge into recovery oil, water, and sediment; and c) mixing the recovery oil with crude oil and performing fractional distillation on a mixture of the recovery oil and the crude oil.
    Type: Application
    Filed: June 9, 2015
    Publication date: December 10, 2015
    Inventors: Chang Woo Joo, Soojung Park, Kwan Bum Lee, Min Seob Lee, Ki Seok Choi, Sung Ho Lee, Yong Jae Lee
  • HEAT DISSIPATION PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    Publication number: 20150181690
    Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.
    Type: Application
    Filed: October 16, 2014
    Publication date: June 25, 2015
    Inventors: Mun Jong KIM, Kwan Bum LEE, Jin Su YEOM