Abstract: A solid electrolytic condenser includes a condenser element, an anode wire including one end inserted into the condenser element, a cathode drawing layer formed on outer side of the condenser element, terminal reinforcements arranged respectively under opposite side portions of a bottom surface of the condenser element, a liquid epoxy resin filled in spaces between the terminal reinforcements and between the bottom surface of the condenser element and top surfaces of the terminal reinforcements, a molding part surrounding the condenser element while exposing the other end of the anode wire, an end portion of the cathode drawing layer, and bottom surfaces of the terminal reinforcements, and anode and cathode terminals formed by a plating layer provided on the bottom surfaces of the terminal reinforcements and on opposite side surfaces of the molding part. The liquid epoxy resin includes fillers of a smaller size than those in the molding part.

Abstract: An electric double layer capacitor (EDLC) includes an electric double layer cell and first and second external electrodes. The electric double layer cell includes a separator and at least one first polarizable electrode and at least one second polarizable electrode. The first and second external electrodes are formed at first and second side surfaces of the electric double layer cell facing each other, respectively. The first polarizable electrode includes a first current collection layer and a first active material layer formed on either surface of the first current collection layer facing the separator and the second polarizable electrode includes a second current collection layer and a second active material layer formed on either surface of the second current collection layer facing the separator.

Abstract: A solid capacitor according to an aspect of the invention may include: a capacitor device having an anode lead wire extending from one side thereof; a case molding the capacitor device and exposing the anode lead wire to the outside thereof; cathode and anode lead frames exposed on the outside the case and electrically connected to the capacitor device; a reinforcement interposed in the case between the anode lead wire and the anode lead frame so as to support the capacitor device and electrically connecting the anode lead wire and the anode lead frame; and a resin shielding part applied to the exposed portion of the anode lead wire to prevent the infiltration of foreign substances through the anode lead wire.

Abstract: The present invention relates to a solid electrolytic capacitor and a method for preparing the same. There is provided a solid electrolytic capacitor in accordance with the invention including a capacitor element with anode polarity therein and a cathode layer formed on an outer surface thereof; an anode wire with an end portion protruding on one surface of the capacitor element; a cathode lead layer formed on the other surface the capacitor element; a molding part surrounding the capacitor element to expose the protruding end portion of the anode wire and an end portion of the cathode lead layer; and an anode terminal and a cathode terminal formed by a plating layer at both sides of the molding part. It is possible to save preparation cost by simplifying a structure and a preparation process of the solid electrolytic capacitor.

Abstract: There is provided a solid electrolytic capacitor, including: a condenser element including a positive electrode wire inserted and mounted to be biased from a center of a chip body; a positive electrode terminal including a pattern layer extendedly formed to the positive electrode wire to be bonded to the positive electrode wire; and a negative electrode terminal electrically connected to the condenser element.

Abstract: A solid electrolytic capacitor includes a capacitor element surrounded with a cathode layer, an anode wire inserted into the capacitor element, a cathode terminal electrically connected to the capacitor element by being positioned at one side below the capacitor element, an anode terminal defining a space between the capacitor element and a top surface thereof and is electrically connected to the anode wire by being positioned at the other side below the capacitor element, a conductive paste coated being thicker toward an inside of the capacitor element, thereby electrically connecting the capacitor element to the cathode terminal and broadening the space, and a fixing film closely coupled to a bottom surface of the conductive paste. A molding unit wraps the capacitor element and the fixing film in a state of closely adhering the conductive paste and the cathode terminal to top and bottom surfaces of the fixing film, respectively.

Abstract: There is provided a method of manufacturing a solid electrolytic capacitor including: forming a conductive polymer layer on a surface of a metal pellet; and forming a dielectric layer between the metal pellet and the conductive polymer layer. Because the conductive polymer layer is directly formed on the surface of the metal pellet, the conductive polymer layer can be uniformly formed, and because there is no need to form an electrode on the surface of the dielectric layer, the process can be reduced. In addition, because the uniform polymer film is formed irrespective of the size of metal pores and the shape of the capacitor, a capacity of the capacitor can be maximized.

Abstract: An electric double layer capacitor (EDLC) includes an electric double layer cell and first and second external electrodes. The electric double layer cell includes a separator and at least one first polarizable electrode and at least one second polarizable electrode. The first and second external electrodes are formed at first and second side surfaces of the electric double layer cell facing each other, respectively. The first polarizable electrode includes a first current collection layer and a first active material layer formed on either surface of the first current collection layer facing the separator and the second polarizable electrode includes a second current collection layer and a second active material layer formed on either surface of the second current collection layer facing the separator.

Abstract: Disclosed is a solid electrolytic condenser and method for manufacturing the same.

Abstract: A solid capacitor according to an aspect of the invention may include: a capacitor device having an anode lead wire extending from one side thereof; a case molding the capacitor device and exposing the anode lead wire to the outside thereof; cathode and anode lead frames exposed on the outside the case and electrically connected to the capacitor device; a reinforcement interposed in the case between the anode lead wire and the anode lead frame so as to support the capacitor device and electrically connecting the anode lead wire and the anode lead frame; and a resin shielding part applied to the exposed portion of the anode lead wire to prevent the infiltration of foreign substances through the anode lead wire.

Abstract: The present invention relates to a solid electrolytic capacitor with increased capacitance. The solid electrolytic capacitor of the present invention includes a capacitor element which includes positive polarity inside and inserts an anode wire into one end while surrounding an external surface with a cathode layer; a cathode terminal electrically connected to the capacitor element by being positioned at one side of a lower part of the capacitor element; an anode terminal which includes a molding injection space on a top surface and is electrically connected to the anode wire by being positioned at the other side of the lower part of the capacitor element; and a molding unit which wraps an exterior of the capacitor element and is formed to expose bottom surfaces of the anode terminal and the cathode terminal.

Abstract: The present invention relates to a solid electrolytic capacitor and a method for preparing the same. There is provided a solid electrolytic capacitor in accordance with the invention including a capacitor element with anode polarity therein and a cathode layer formed on an outer surface thereof; an anode wire with an end portion protruding on one surface of the capacitor element; a cathode lead layer formed on the other surface the capacitor element; a molding part surrounding the capacitor element to expose the protruding end portion of the anode wire and an end portion of the cathode lead layer; and an anode terminal and a cathode terminal formed by a plating layer at both sides of the molding part. It is possible to save preparation cost by simplifying a structure and a preparation process of the solid electrolytic capacitor.

Abstract: A tantalum capacitor including: a capacitor body containing a tantalum powder and having a mounting surface; a cathode lead frame having the capacitor body mounted thereon; a tantalum wire having an insertion portion located inside the capacitor body and a non-insertion portion located outside the capacitor body; an anode lead frame connected to the non-insertion portion of the tantalum wire; and a resin mold surrounding the capacitor body and the tantalum wire, wherein the insertion portion of the tantalum wire has at least one bending.

Abstract: A chip type solid electrolytic capacitor, in which a PCB includes anode and cathode connection lands formed on upper parts of an insulation board, and anode and cathode terminals formed on lower parts of the insulation board. The anode and cathode terminals are electrically connected to the anode and cathode connection lands, respectively, through vias. An anode connection member is formed on the anode connection land. A capacitor device having an anode lead and a cathode layer is mounted on the PCB with the anode lead weld-connected to the anode connection member and the cathode layer electrically connected to the cathode connection land via a conductive adhesive. An outer resin covers side and upper parts of the PCB including the capacitor device. The anode terminal and the cathode terminal have stepped-down surfaces which are formed along at least parts of peripheral portions thereof, respectively, and covered by the outer resin.

Abstract: A tantalum capacitor including: a capacitor body containing a tantalum powder and having a mounting surface; a cathode lead frame having the capacitor body mounted thereon; a tantalum wire having an insertion portion located inside the capacitor body and a non-insertion portion located outside the capacitor body; an anode lead frame connected to the non-insertion portion of the tantalum wire; and a resin mold surrounding the capacitor body and the tantalum wire, wherein the insertion portion of the tantalum wire has at least one bending.

Abstract: A chip type solid electrolytic capacitor, in which a PCB includes anode and cathode connection lands formed on upper parts of an insulation board, and anode and cathode terminals formed on lower parts of the insulation board. The anode and cathode terminals are electrically connected to the anode and cathode connection lands, respectively, through vias. An anode connection member is formed on the anode connection land. A capacitor device having an anode lead and a cathode layer is mounted on the PCB with the anode lead weld-connected to the anode connection member and the cathode layer electrically connected to the cathode connection land via a conductive adhesive. An outer resin covers side and upper parts of the PCB including the capacitor device. The anode terminal and the cathode terminal have stepped-down surfaces which are formed along at least parts of peripheral portions thereof, respectively, and covered by the outer resin.

Abstract: A solid electrolytic capacitor includes a capacitor element, an anode wire extending from a first side of the capacitor element by a predetermined length, and an anode lead frame forming an anode terminal. The anode lead frame has a groove at a first end thereof for receiving an end portion of the terminal end of the anode wire thereon, and has a second end thereof mounted on a PCB. A cathode lead frame forms a cathode terminal and has a first end attached to an external surface of the capacitor element and a second end mounted on the PCB. An epoxy case covers the capacitor element, the anode lead frame, and the cathode lead frame. The anode wire is welded to the anode lead frame.

Abstract: Disclosed is a solid electrolytic capacitor, comprising a capacitor element, an anode wire extended from a first side of the capacitor element in a predetermined length, and an anode lead frame formed as an anode terminal. The anode lead frame has a groove at a first end thereof for mounting an end portion of the terminal end of the anode wire thereon, and is mounted at a second end thereof on a PCB. A cathode lead frame is formed as a cathode terminal. This cathode lead frame has a first end attached to an external surface of the capacitor element and a second end mounted on the PCB. An epoxy case covers the capacitor element, the anode lead frame, and the cathode lead frame. The anode wire is welded to the anode lead frame by melting a portion of the anode lead frame in contact with an end portion of the anode wire positioned on the groove, using a heat source.