Patents by Inventor Kwan-Kin CHAN

Kwan-Kin CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140216577
    Abstract: A gas release device is formed of two plates combined together. Each of the plates includes an intake groove. Each of the intake grooves is linked with a first distribution groove. Each of the first distribution grooves is linked with two second distribution grooves. Each of the second distribution grooves is linked with two third distribution grooves. Each of the third distribution grooves is linked with two fourth distribution grooves. Each of the fourth distribution grooves is linked with two fifth distribution grooves. Each of the fifth distribution grooves has a venthole. After a gas of a vapor deposition source enters the intake groove, the gas passes through the first, second, third, fourth, and fifth distribution grooves in order and then substantially equal amount of the gas is finally released out of each of the ventholes.
    Type: Application
    Filed: January 28, 2014
    Publication date: August 7, 2014
    Applicant: ADPV TECHNOLOGY LIMITED
    Inventors: Shiezen Steven HUANG, Ke-Feng LIAO, Wen-Bo LAI, Kwan-Kin CHAN, Sheng LI, Liang MENG, Jhao-Lung ZENG, Guan-Bi CHEN
  • Publication number: 20140220878
    Abstract: A gas release device for a coating process includes an upper plate, a first intermediate plate, a second intermediate plate, and a lower plate, four of which are superposed on each other from top to bottom. The upper plate is linked and communicates with the first intermediate plate through a first passage. The first intermediate plate is linked and communicates with the second intermediate plate through at least two second passages. The second intermediate plate is linked with the lower plate through at least four third passages. The lower plate includes at least four ventholes. In light of this, after a gas of a vapor deposition source enters the inlet, the gas of the same amount can be released out of each venthole to make the thickness of a thin film uniform for relatively higher quality of the coating process.
    Type: Application
    Filed: January 28, 2014
    Publication date: August 7, 2014
    Applicant: ADPV TECHNOLOGY LIMITED
    Inventors: Shiezen Steven HUANG, Ke-Feng LIAO, Wen-Bo LAI, Kwan-Kin CHAN, Sheng LI, Liang MENG, Jhao-Lung ZENG, Guan-Bi CHEN