Abstract: The present invention relates to polyphenylene-based composite resin composition for IC TRAY, which comprises polyphenyleneoxide or polyphenylene ether at the amount of 20 to 98 wt % of total composition weight; one or more resins selected from the group consisting of polystylene, polyphenylene sulfide, polyetherimide, polycarbonate and polyethylene (including HDPE, LDPE, LLDPE, VLDPE) at the amount of 1 to 40 wt % of total composition weight; and glass fiber or inorganic fillers at the amount of 1 to 40 wt % of total composition weight. In addition, the composition of the present invention has excellent mechanical strength, dimensional stability, low linear fever expansion coefficient, and a good outlook for a product. The composition of the present invention is appropriate for IC TRAY in view that it does not deflect due to contraction, linear expansion coefficient and heat, thus having excellent dimensional stability.