Abstract: A display device includes a substrate including a display area having first color subpixels and a transparent area inside the display area, an array layer in the display area on the substrate, a first electrode in the first color subpixels on the array layer, a first emission assisting layer on the first electrode, an emitting material layer in the first color subpixels on the first emission assisting layer, a second emission assisting layer on the emitting material layer, a deposition preventing layer in the transparent area on the second emission assisting layer, a second electrode on the second emission assisting layer, the second electrode selectively disposed in a region where the deposition preventing layer is not disposed, an encapsulating layer on the deposition preventing layer and the second electrode, a polarizing layer in the display area on the encapsulating layer, an auxiliary equipment in the transparent area under the substrate.

Abstract: In an embodiment of the present invention, a touch screen is provided, the touch screen characterized by: an indium tin oxide (ITO) film deposited on a top surface of a flexible plastic film; a first metal layer deposited on the ITO film, and a second metal layer plated on the first metal layer. According to the embodiment of the present invention, the touch screen and the method of manufacturing the same having the excellent sensitivity while securing durability may be provided.

Abstract: Disclosed herein is a method of manufacturing a color printed circuit board. The method includes non-consecutively printing a conductive ink on a flexible insulation board in a piezoelectric inkjet manner to form an electrically conductive pattern, applying an electrically conductive bonding agent to a light emitting chip mounting portion of the electrically conductive pattern for mounting a light emitting chip, forming a waterproof layer on an overall surface of a resultant after mounting the light emitting chip on the light emitting chip mounting portion of the electrically conductive pattern to which the electrically conductive bonding agent is applied, and forming a color pattern on an overall surface of the light emitting diode using a color ink.

Abstract: The present disclosure relates to a method and apparatus for fabricating an LED signboard, through which an LED signboard is fabricated by printing a circuit pattern with a conductive ink. The method includes generating a design, forming a circuit pattern by printing a conductive ink on an insulation matrix based on the design via a printer, and mounting an LED on the circuit pattern.

Abstract: The present disclosure relates to a method and apparatus for fabricating an LED signboard, through which an LED signboard is fabricated by printing a circuit pattern with a conductive ink. The method includes generating a design, forming a circuit pattern by printing a conductive ink on an insulation matrix based on the design via a printer, and mounting an LED on the circuit pattern.

Abstract: Disclosed herein is a method of manufacturing a color printed circuit board. The method includes non-consecutively printing a conductive ink on a flexible insulation board in a piezoelectric inkjet manner to form an electrically conductive pattern, applying an electrically conductive bonding agent to a light emitting chip mounting portion of the electrically conductive pattern for mounting a light emitting chip, forming a waterproof layer on an overall surface of a resultant after mounting the light emitting chip on the light emitting chip mounting portion of the electrically conductive pattern to which the electrically conductive bonding agent is applied, and forming a color pattern on an overall surface of the light emitting diode using a color ink.