Abstract: An image sensor package module with a leadless leadframe between chips includes a chip carrier, an image sensor chip, an integrated circuit chip, and a flexible printed circuit board. The chip carrier comprises a leadless leadframe and a pre-molded body. The leadless leadframe has a plurality of leads. The pre-molded body is completely filled among the leads and has a dam on the upper surfaces of the leads. The upper surfaces and lower surfaces of the leads are exposed on the pre-molded body. The image sensor chip is attached to the chip carrier inside the dam and electrically connected to the upper surfaces of the leads. The integrated circuit chip is mounted on the lower surfaces of the leads via bumps. The flexible printed circuit board is electrically connected to the leads for signal transmission.

Abstract: An ortho-alkylation method of an aromatic ketone. In the method, as starting materials, the aromatic ketone is reacted with aliphatic or aromatic alkyl moiety-containing olefins in the presence of a primary amine and a transition metal catalyst as reaction catalysts, or ketimines resulting from a reaction of aromatic ketones with a primary amine are reacted with aliphatic or aromatic alkyl moiety-containing olefins in the presence of a transition metal catalyst, thereby introducing the alkyl moiety to the ortho-position of the aromatic ketone.