Abstract: A computing resource management system using software modularization in a cluster computing environment in which computing devices are connected, including an application process running on each computing device and an algorithm processing process configured to run independently of the application process and perform task processing on the application process, the computing resource management system including: a task managing system configured to receive a task request message from an application process requiring a task from each computing device; a process managing system configured to confirm an algorithm processing process of computing devices connected to the cluster computing environment, and determine whether there is an algorithm processing process in an idle state to which the application process requested for a task will be assigned; and a performed managing system configured to confirm a result of an application process whose task is performed by the algorithm processing process.

Abstract: There are provided an optical pointing module having a lighting function and an electric device that can be used at night or dark place. An optical pointing module having a lighting function according to an aspect of the invention may include: a laser light source mounted on a printed circuit board; an outer housing through which laser light, emitted from the laser light source, passes, the outer housing having an outside part formed of a transparent material; and a lighting unit mounted inside the outer housing and supplying light to the outside part.

Abstract: Disclosed are an optical pointing module and an electronic apparatus that are reduced in size in order to be used in a personal portable terminal. An optical pointing module according to an aspect of the invention may include: a laser light source mounted on a printed circuit board; an outer housing through which laser light, emitted from the laser light source, is transmitted; a light receiving unit located on the printed circuit board, receiving the laser light being reflected from the outer housing by an external stimulus, and transmitting an electrical signal to an integrated circuit; and an inner housing received in the outer housing and having a passage recess, through which the laser light passes, and a contact surface coming into contact with an inner surface of the outer housing, the contact surface having a height different from that of a surface of the inner housing having the passage recess therein.

Abstract: A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first conductive layer formed on the first surface of the chip, a second conductive layer formed on the second surface of the chip, and a substrate attached to the second surface of the chip and including at least one conductive via hole connected to the second terminal of the chip. And the present invention provides a chip package assembly including the chip package. Further, a method of manufacturing the chip package and an assembly including the chip package are provided. The chip package does not use a bonding wire and additional conductive lands, thereby reducing the size of the package and simplifying the manufacturing process.

Abstract: The present invention relates to an electrode forming method in circuit devices such as boards and chip devices, and a chip package and multilayer board using the same, in particular, in which protective bumps and an insulation layer are provided in terminal areas of a circuit device and then the protective bumps are removed to obtain via holes so that electrodes may be formed for electrical connection with other circuit elements.

Abstract: A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first conductive layer formed on the first surface of the chip, a second conductive layer formed on the second surface of the chip, and a substrate attached to the second surface of the chip and including at least one conductive via hole connected to the second terminal of the chip. And the present invention provides a chip package assembly including the chip package. Further, a method of manufacturing the chip package and an assembly including the chip package are provided. The chip package does not use a bonding wire and additional conductive lands, thereby reducing the size of the package and simplifying the manufacturing process.