Patents by Inventor Kwang-Ho Chun
Kwang-Ho Chun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11953366Abstract: A fluid level measurement system using a buoyant body includes a guide part installed in a direction perpendicular to the bottom surface of a fluid storage tank, and provided with a space in which a fluid can move therein; a buoyant body inserted into the guide part, and configured to float along the surface of the fluid inside the guide part; and a measurement part coupled to the top end of the guide part, and configured to measure the level of the surface of the fluid inside the fluid storage tank by transmitting a signal toward the buoyant body in the inner space of the guide part and then receiving a signal reflected from the buoyant body.Type: GrantFiled: July 7, 2022Date of Patent: April 9, 2024Assignee: HANRA IMS CO., LTDInventors: Suk Joon Ji, Young Gu Kim, Jong Min Chung, Chae Ho Lee, I-Hwan Cheon, Kwang Ik Chun, Dong Sik Jang
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Publication number: 20240095484Abstract: Proposed is a dual band RFID tag including a first rectifier configured to receive and rectify a first RF signal modulated at a first frequency, a first regulator configured to regulate an output voltage of the first rectifier, a second rectifier configured to receive and rectify a second RF signal modulated at a second frequency, a second regulator configured to regulate an output voltage of the second rectifier, a voltage distributor connected to a first node and a ground in a state of being positioned therebetween, the output terminal of the first rectifier and the output terminal of the second rectifier being both connected to the first node, a multiplexer configured to output any one of an analog detection signal output from a sensor and an output signal of the voltage distributor, in response to a first selection signal or a second selection signal, and an analog-to-digital converter configured to receive as an operating voltage a voltage of a second node to which an output terminal of the first regulatType: ApplicationFiled: April 26, 2023Publication date: March 21, 2024Inventors: Sung Wan KIM, Pyeong Han LEE, Kwang Beom PARK, Sung Hun CHUN, Chang Ho RYU
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Publication number: 20110168761Abstract: An apparatus for repairing a semiconductor module including: a heating block comprising a thermal contact surface for contacting a defective semiconductor package mounted on a substrate of the semiconductor module to heat the defective semiconductor package using a conduction method and to melt a solder of the defective semiconductor package, and a vacuum adsorption line for adsorbing the defective semiconductor package and separating the defective semiconductor package from the substrate; and a heater installed in the heating block.Type: ApplicationFiled: January 10, 2011Publication date: July 14, 2011Applicant: Samsung Electronics Co., Ltd.Inventors: Sun-kyu Hwang, Seong-chan Han, Kwang-ho Chun, Jung-hoon Kim, Dong-su Han
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Patent number: 7705449Abstract: A cooling apparatus for a circuit module having a substrate extending axially with an IC chip of a first type and IC chips of a second type mounted thereon, comprising: a first heat spreading element disposed to form a heat conduction path with the IC chip of the first type; and a second heat spreading element disposed to form a heat conduction path with the IC chips of the second type, wherein there is at least one IC chip of the second type mounted axially away from opposite sides of the IC chip of the first type, wherein the first type of IC chip is capable of generating a larger amount of heat than the second type of IC chips, and the first heat spreading element has a higher thermal conductivity than the second heat spreading element.Type: GrantFiled: September 27, 2006Date of Patent: April 27, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Joong Hyun Baek, Yong Hyun Kim, Kwang Ho Chun, Chang Yong Park, Hae Hyung Lee, Hee Jin Lee
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Patent number: 7675176Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall.Type: GrantFiled: December 31, 2007Date of Patent: March 9, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-Yong Park, Kwang-Ho Chun, Dong-Chun Lee, Yong-Hyun Kim
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Patent number: 7606035Abstract: Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.Type: GrantFiled: September 21, 2007Date of Patent: October 20, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-Yong Park, Yong-Hyun Kim, Kwang-Ho Chun, Hyun-Jong Oh
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Publication number: 20090257209Abstract: A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.Type: ApplicationFiled: April 13, 2009Publication date: October 15, 2009Inventors: Seong-Chan Han, Jin-Kyu Yang, Dong-Chun Lee, Kwang-Ho Chun
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Patent number: 7518873Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.Type: GrantFiled: July 6, 2006Date of Patent: April 14, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-Yong Park, Hyun-Jong Oh, Yong-Hyun Kim, Dong-Woo Shin, Kyung-Du Kim, Dong-Chun Lee, Kwang-Ho Chun
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Publication number: 20080157389Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall.Type: ApplicationFiled: December 31, 2007Publication date: July 3, 2008Inventors: Chang-Yong Park, Kwang-Ho Chun, Dong-Chun Lee, Yong-Hyun Kim
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Publication number: 20080074848Abstract: Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.Type: ApplicationFiled: September 21, 2007Publication date: March 27, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chang-Yong PARK, Yong-Hyun KIM, Kwang-Ho CHUN, Hyun-Jong OH
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Publication number: 20070170580Abstract: A cooling apparatus for a circuit module having a substrate extending axially with an IC chip of a first type and IC chips of a second type mounted thereon, comprising: a first heat spreading element disposed to form a heat conduction path with the IC chip of the first type; and a second heat spreading element disposed to form a heat conduction path with the IC chips of the second type, wherein there is at least one IC chip of the second type mounted axially away from opposite sides of the IC chip of the first type, wherein the first type of IC chip is capable of generating a larger amount of heat than the second type of IC chips, and the first heat spreading element has a higher thermal conductivity than the second heat spreading element.Type: ApplicationFiled: September 27, 2006Publication date: July 26, 2007Inventors: Joong Hyun Baek, Yong Hyun Kim, Kwang Ho Chun, Chang Young Park, Hae Hyung Lee, Hee Jin Lee
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Publication number: 20070161224Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.Type: ApplicationFiled: March 16, 2007Publication date: July 12, 2007Inventors: Chang-Yong Park, Byung-Man Kim, Dong-Chun Lee, Yong-Hyun Kim, Kwang-Seop Kim, Dong-Woo Shin, Kwang-Ho Chun
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Patent number: 7215026Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.Type: GrantFiled: October 11, 2005Date of Patent: May 8, 2007Assignee: Samsung Electonics Co., LtdInventors: Chang-Yong Park, Byung-Man Kim, Dong-Chun Lee, Yong-Hyun Kim, Kwang-Seop Kim, Dong-Woo Shin, Kwang-Ho Chun
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Publication number: 20070069378Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.Type: ApplicationFiled: November 28, 2006Publication date: March 29, 2007Inventors: Chang-Yong Park, Byung-Man Kim, Dong-Chun Lee, Yong-Hyun Kim, Kwang-Seop Kim, Dong-Woo Shin, Kwang-Ho Chun
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Publication number: 20070008703Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.Type: ApplicationFiled: July 6, 2006Publication date: January 11, 2007Inventors: Chang-Yong Park, Hyun-Jong Oh, Yong-Hyun Kim, Dong-Woo Shin, Kyung-Du Kim, Dong-Chun Lee, Kwang-Ho Chun
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Publication number: 20060231949Abstract: In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.Type: ApplicationFiled: October 11, 2005Publication date: October 19, 2006Inventors: Chang-Yong Park, Byung-Man Kim, Dong-Chun Lee, Yong-Hyun Kim, Kwang-Seop Kim, Dong-Woo Shin, Kwang-Ho Chun
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Publication number: 20060228878Abstract: A lower-melting-point solder having a lower melting point than solder balls is used to bond the solder balls with a module substrate. The lower-melting-point solder has a melting point lower than the solder balls. A bonding temperature is at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls.Type: ApplicationFiled: March 24, 2006Publication date: October 12, 2006Inventors: Chang-Yong Park, Kyung-Du Kim, Kwang-Ho Chun, Byung-Man Kim, Yong-Hyun Kim, Hyun-Jong Oh
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Patent number: 7005735Abstract: The array printed circuit board includes at least one circuit board having a first surface. A first layout of first and second chip mounting regions is formed on a first half of the first surface and a second layout of first, and second chip mounting regions is formed on a second half of the first surface. The first and second layouts have opposite first and second chip mounting region patterns.Type: GrantFiled: February 11, 2004Date of Patent: February 28, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Chang-Yong Park, Byung-Man Kim, Jong-Soo Choi, Kwang-Ho Chun, Se-Hyung Ryu
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Publication number: 20040238932Abstract: The array printed circuit board includes at least one circuit board having a first surface. A first layout of first and second chip mounting regions is formed on a first half of the first surface and a second layout of first, and second chip mounting regions is formed on a second half of the first surface. The first and second layouts have opposite first and second chip mounting region patterns.Type: ApplicationFiled: February 11, 2004Publication date: December 2, 2004Inventors: Chang-Yong Park, Byung-Man Kim, Jong-Soo Choi, Kwang-Ho Chun, Se-Hyung Ryu