Abstract: Provided is a display device comprising a display panel, a metal plate on a bottom surface of the display panel, the metal plate including a first surface facing the bottom surface of the display panel and a second surface opposite to the one surface, and a fingerprint sensor overlappingly disposed on the second surface of the metal plate, wherein the metal plate includes an indentation groove recessed in a direction toward the first surface from the second surface of the metal plate, and the fingerprint sensor is disposed on the second surface of the metal plate on which the indentation groove is formed.

Abstract: A device for preventing errors during semiconductor wafer fabrication can be configured to prevent separation of optical sensor unit components, such as a gas supply pipe and a fixing guide, that could be caused by excess N2 gas pressure. The device can also be configured to prevent excess moisture build-up that can lead to wafer sensing errors. The device includes a bath for receiving pure water or chemicals to remove particles. The bath can be further configured to discharge waste water after removal of the particles. Fixing guides are disposed at the outside of the bath to fix optical fiber sensors thereto. Optical fiber sensors are inserted into gas supply pipes, partially secured within the fixing guides. Purge output holes are formed at predetermined locations along the fixing guides to release N2 gas pressure. A method for releasing excess pressure and a method for discharging excess moisture from an optical sensor unit are also provided.

Abstract: A device for preventing errors during semiconductor wafer fabrication can be configured to prevent separation of optical sensor unit components, such as a gas supply pipe and a fixing guide, that could be caused by excess N2 gas pressure. The device can also be configured to prevent excess moisture build-up that can lead to wafer sensing errors. The device includes a bath for receiving pure water or chemicals to remove particles. The bath can be further configured to discharge waste water after removal of the particles. Fixing guides are disposed at the outside of the bath to fix optical fiber sensors thereto. Optical fiber sensors are inserted into gas supply pipes, partially secured within the fixing guides. Purge output holes are formed at predetermined locations along the fixing guides to release N2 gas pressure. A method for releasing excess pressure and a method for discharging excess moisture from an optical sensor unit are also provided.

Abstract: A device for preventing errors during semiconductor wafer fabrication can be configured to prevent separation of optical sensor unit components, such as a gas supply pipe and a fixing guide, that could be caused by excess N2 gas pressure. The device can also be configured to prevent excess moisture build-up that can lead to wafer sensing errors. The device includes a bath for receiving pure water or chemicals to remove particles. The bath can be further configured to discharge waste water after removal of the particles. Fixing guides are disposed at the outside of the bath to fix optical fiber sensors thereto. Optical fiber sensors are inserted into gas supply pipes, partially secured within the fixing guides. Purge output holes are formed at predetermined locations along the fixing guides to release N2 gas pressure. A method for releasing excess pressure and a method for discharging excess moisture from an optical sensor unit are also provided.