Patents by Inventor Kwang Hwan Cho

Kwang Hwan Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991878
    Abstract: A semiconductor device include a nonvolatile memory device, including a first well region formed in a substrate, a tunneling gate insulator formed on the first well region, a floating gate formed on the tunneling gate insulator, a control gate insulator formed on the substrate, a control gate formed on the control gate insulator, and a first source region and a first drain region formed on opposite sides of the control gate, respectively, and a first logic device, including a first logic well region formed in the substrate, a first logic gate insulator formed on the first logic well region, a first logic gate formed on the first logic gate insulator, wherein the first logic gate comprises substantially a same material as a material of the control gate of the nonvolatile memory device.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: May 21, 2024
    Assignee: SK keyfoundry Inc.
    Inventors: Kwang Il Kim, Yang Beom Kang, Jung Hwan Lee, Min Kuck Cho, Hyun Chul Kim
  • Publication number: 20240145346
    Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
  • Publication number: 20240131943
    Abstract: An apparatus for holding a cable for an electric vehicle charger includes a cable holding unit configured to restrict a charging cable extended and connected to a charging coupler, and to ascend or descend to predetermined positions, a housing unit mounted in a manner that is rotatable along a leftward-rightward direction, the cable holding unit being accommodated inside the housing unit, a driving unit configured to provide drive power for enabling the cable holding unit to ascend and descend and drive power for rotating the housing unit, and a control unit configured to control the driving unit in such a manner that the cabling holding unit and the housing unit are selectively driven when the charging coupler is removed from an electric vehicle charger or rests thereon.
    Type: Application
    Filed: February 6, 2023
    Publication date: April 25, 2024
    Inventors: Woo Hyung Lee, Su Hwan Cho, Young Tae Choi, Kwang Min Oh, Ho Choi
  • Patent number: 11964805
    Abstract: The present disclosure relates to a container for retort food and, more specifically, to a container for retort food including: a container body in which food may be input and stored; and an inner cap covering the container body. The inner cap covering the container body has a predetermined depth, and thus, effective sterilization may be performed during a retort processing process, overflow of the food in the container body may be prevented, and there is an advantage in satisfying regulations regarding a packing space ratio.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: April 23, 2024
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Ki Pyo Kim, Yong Hwan Kim, Kyoung Sik Cho, Kwang Soo Park, Byung Kook Lee
  • Publication number: 20150132626
    Abstract: An electrode assembly and a secondary battery using the same are disclosed. The electrode assembly includes a positive electrode, a negative electrode, and a lithium ion conductor layer disposed at least in one of between the positive electrode and the negative electrode, on an outer surface of the positive electrode, and on an outer surface of the negative electrode, to improve thermal safety of the secondary battery.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 14, 2015
    Inventors: Young-Jin Park, Do-Hyung Park, Ki-Hyun Kim, Min-Han Kim, Sang-Hoon Kim, Yu-Mi Song, Sun-Ho Kang, Kwang-Hwan Cho
  • Publication number: 20100330298
    Abstract: A method for fabricating a ferroelectric ceramic film. The method includes coating a gel film on a substrate. The gel film has at least one ferroelectric material and at least one ultra-violet (UV) sensitive material. The method further includes simultaneously heating the gel film and irradiating a UV ray onto the gel film transforming the gel film into an amorphous ferroelectric film made of the at least one ferroelectric material. The above heating may be performed by using a rapid thermal processing technique.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Inventors: Chong Yun Kang, Kwang Hwan Cho, Seok-Jin Yoon, Min Gyu Kang