Patents by Inventor Kwanghyeon JEONG

Kwanghyeon JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240347370
    Abstract: A carrier dechucking system includes a work carrier including a substrate having a first surface, an opposite second surface with a support film attached, and a ring frame surrounding the substrate. The work carrier is placed on a placement table having a support surface on which a lower surface of the support film is maintained, lifting pins configured to move the work carrier, an ionizer configured to eject ions to the lower surface, and a controller. The controller is configured to control the lifting pins to move the work carrier from the support surface to first and second levels, and to control the ionizer to remove static electricity charged on the support film from the support surface to the first level. At the first level, a surface voltage of the first surface of the substrate is lower than a surface voltage of the lower surface of the support film.
    Type: Application
    Filed: December 15, 2023
    Publication date: October 17, 2024
    Inventors: Dongjoon Lee, Kyoungran Kim, Kwanghyeon Jeong, Myeongock Ko, Jaeuk Sim, Seongbeom Lee, Daesung Jung
  • Patent number: 11764087
    Abstract: A process apparatus includes a heating module and a supporter disposed below the heating module. A process space is provided between the heating module and the supporter. The heating module includes a housing, at least one heating lamp disposed in the housing, at least one temperature sensor disposed in the housing, and a blocking plate disposed under the housing. The blocking plate spatially separates the at least one heating lamp from the process space, and the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: September 19, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chaemook Lim, Yeongrack Son, Ohhyuk Kwon, Dongouk Kim, Youngbum Kim, Woohee Kim, Dongjoon Lee, Kwanghyeon Jeong
  • Publication number: 20210183672
    Abstract: A process apparatus includes a heating module and a supporter disposed below the heating module. A process space is provided between the heating module and the supporter. The heating module includes a housing, at least one heating lamp disposed in the housing, at least one temperature sensor disposed in the housing, and a blocking plate disposed under the housing. The blocking plate spatially separates the at least one heating lamp from the process space, and the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space.
    Type: Application
    Filed: June 11, 2020
    Publication date: June 17, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chaemook LIM, Yeongrack SON, Ohhyuk KWON, Dongouk KIM, Youngbum KIM, Woohee KIM, Dongjoon LEE, Kwanghyeon JEONG