Abstract: Disclosed is an interface system including a first neuron cluster that outputs a first neuron signal including a first neuron request and first neuron data by performing a first arithmetic operation, and a first interface circuit that stores the first neuron data and outputs a first response, in response to the first neuron request. The first neuron cluster outputs a second neuron signal including a second neuron request and second neuron data by performing a second arithmetic operation, in response to the first response. Before the first data is transmitted to a second neuron cluster different from the first neuron cluster, the first interface circuit outputs the first response in response to a fact that the first neuron data is stored.

Abstract: The present invention provides a pharmaceutical composition for prevention or treatment of a stress disease and depression, the pharmaceutical composition be safely useable without toxicity and side effects by using an extract of leaves of Vaccinium bracteatum Thunb., which is natural resource of Korea, so that the reduction of manufacturing and production costs and the import substitution and export effects can be expected through the replacement of a raw material for preparation with a plant inhabiting in nature.

Abstract: An electronic device is provided.

Abstract: An electronic device is provided.

Abstract: An electronic device is provided.

Abstract: A UniDirectional (UD) preimpregnated material (prepreg) and method of production are provided. A plurality of reinforced fibers are arranged in one direction. At least one auxiliary fiber is arranged such that it crosses the plurality of reinforced fibers to maintain the arrangement of the plurality of reinforced fibers. The plurality of reinforced fibers and the at least one auxiliary fiber are impregnated with a coupling material, and the coupling material is cured with the plurality of reinforced fibers and the at least one auxiliary fiber.

Abstract: A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

Abstract: An electronic device is provided.

Abstract: A housing forms the appearance of an electronic device. A method of manufacturing the housing includes selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility, determining quantity and stacking sequence of the selected fiber substrates, and laminating and attaching the fiber substrates according to the determined quantity and stacking sequence.

Abstract: A device for molding a semiconductor package including an upper mold configured to retain a substrate thereon, the substrate having semiconductor chips thereon, a lower mold defining a cavity and including a plurality of moving blocks, a bottom surface of the cavity defined by the moving blocks, the cavity configured to contain a molding resin, the moving blocks movably arranged under the cavity, a driving unit configured to movably drive the moving blocks, and a controller configured to control an raising order of the moving blocks by controlling the driving unit may be provided.

Abstract: An electronic device is provided which may include a tray, an exterior cover, and/or a first hooking structure. The tray may be inserted or drawn to or from an inside via an opening of a housing of the electronic device, and may include a space for receiving a card. The exterior cover may be movably coupled to the tray. The first hooking structure may be disposed inside the electronic device, and may maintain a closed state of the exterior cover, and may release the closed state of the exterior cover in response to pressing of the exterior cover.

Abstract: A display module fixing apparatus used in a portable terminal such as a smart phone, a tablet Personal Computer (PC), or the like is provided. The fixing apparatus includes a display module bracket comprising an opening in a predetermined shape and a slim plate integrally fixed to the display module bracket into the opening. Therefore, the portable terminal using the display module fixing apparatus achieves slimness thereof.

Abstract: An electronic device is provided which may include a tray, an exterior cover, and/or a first hooking structure. The tray may be inserted or drawn to or from an inside via an opening of a housing of the electronic device, and may include a space for receiving a card. The exterior cover may be movably coupled to the tray. The first hooking structure may be disposed inside the electronic device, and may maintain a closed state of the exterior cover, and may release the closed state of the exterior cover in response to pressing of the exterior cover.

Abstract: A window of an electronic device includes a shooting region at a position corresponding to a camera lens assembly. The window includes a front surface, a rear surface, and an inclined surface. The front surface includes the shooting region and is formed in a curved shape. An inclined surface is disposed to have a slope corresponding to a curvature of the front surface in at least a portion of the rear surface corresponding to the shooting region. Therefore, deterioration of image capture quality such as distortion by the camera lens assembly and internal reflection is effectively prevented by the inclined surface.

Abstract: A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.

Abstract: A UniDirectional (UD) preimpregnated material (prepreg) and method of production are provided. A plurality of reinforced fibers are arranged in one direction. At least one auxiliary fiber is arranged such that it crosses the plurality of reinforced fibers to maintain the arrangement of the plurality of reinforced fibers. The plurality of reinforced fibers and the at least one auxiliary fiber are impregnated with a coupling material, and the coupling material is cured with the plurality of reinforced fibers and the at least one auxiliary fiber.

Abstract: A housing forms the appearance of an electronic device. A method of manufacturing the housing includes selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility, determining quantity and stacking sequence of the selected fiber substrates, and laminating and attaching the fiber substrates according to the determined quantity and stacking sequence.

Abstract: A multi-layer printed circuit board (PCB) and a method for fabricating the same are provided. The multi-layer printed circuit board may include a first film and a first insulation layer. The first film may include a first via therein and the first film may further include a first conductive pattern on an upper surface thereof and the first conductive layer may be electrically connected to the first via. The first insulation layer may be on the upper surface of the first film and the first insulation layer may include a second via therein and a second conductive pattern on an upper surface thereof and the second conductive pattern may be electrically connected to the second via. The second via may be electrically connected to the first conductive pattern.

Abstract: An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.

Abstract: A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.