Patents by Inventor Kwang Jin Gooi
Kwang Jin Gooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230411882Abstract: A single-slot peripheral component interconnect express (PCIe) card with expanded memory is provided. Embodiments described herein use two rigid circuit boards which are oriented perpendicular to each other. The two rigid circuit boards are connected by a flexible cable, which can be sandwiched between the laminates of the rigid boards. The flexible cable further provides high-speed signal connection and high-power connection between the two rigid boards. In addition, the two rigid boards can be secured by two mechanical retainers. This approach enables a PCIe card to have three or more (e.g., four) dual in-line memory modules (DIMMs) while meeting the PCIe standard for single slot primary side height by placing the DIMM sockets horizontally, thus lowering the overall height of the PCIe card.Type: ApplicationFiled: December 22, 2022Publication date: December 21, 2023Inventors: JINYING SHEN, KWANG JIN GOOI
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Patent number: 11552416Abstract: A memory module testing system operating in a vibratory environment can retain a memory module in place in a memory socket using both socket latches and a retainer clip. The retainer clip can attach to a module support tower of the memory socket. The retainer clip can have a flexible multi-spring structure forming a three-axis vibration dampening system that can prevent the socket latches from opening while testing in the test environment. The retainer clip can secure the socket latches using an upper flange and a lower flange to prevent unintended motion of the socket latches. The retainer clip can be secured to the module support towers at the ends of the memory socket using clip arms and clip arm tips to attach to the module support towers.Type: GrantFiled: February 13, 2020Date of Patent: January 10, 2023Assignee: SMART MODULAR TECHNOLOGIES SDN. BHD.Inventors: Kwang Jin Gooi, Muhammad Annuar Bin Johani, Ali Akbar Bin Abdul Aziz
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Publication number: 20220399682Abstract: A memory module operation system for operating in high stress environments with strong vibration. The application and use of a retainer to reduce and dampen the effects of system vibration and the application of dynamic loads can retain a memory module in place in a memory socket. Further, the retainer can operate to reduce the effects of electromagnetic interference and can act as a heat transport system to reduce thermal stress on components.Type: ApplicationFiled: May 26, 2022Publication date: December 15, 2022Inventors: Kwang Jin Gooi, Satyanarayan Iyer, Muhammad Annuar Bin Johani, Ali Akbar Bin Abdu Aziz
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Publication number: 20210203090Abstract: A memory module testing system operating in a vibratory environment can retain a memory module in place in a memory socket using both socket latches and a retainer clip. The retainer clip can attach to a module support tower of the memory socket. The retainer clip can have a flexible multi-spring structure forming a three-axis vibration dampening system that can prevent the socket latches from opening while testing in the test environment. The retainer clip can secure the socket latches using an upper flange and a lower flange to prevent unintended motion of the socket latches. The retainer clip can be secured to the module support towers at the ends of the memory socket using clip arms and clip arm tips to attach to the module support towers.Type: ApplicationFiled: February 13, 2020Publication date: July 1, 2021Inventors: Kwang Jin Gooi, Muhammad Annuar Bin Johani, Ali Akbar Bin Abdul Aziz
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Patent number: 10488892Abstract: Approaches, techniques, and mechanisms are disclosed for manufacturing and operating portable module systems. The portable module systems can provide additional computing, memory, communication, networking, and power functionality in compact package that can be connected to a host system. The portable module system can dissipate thermal energy using an embedded cooling system to allow the use of high performance components. The portable module system can improve the functionality and computing capacity of the host system by linking off the shelf component boards with the external bus using a bridge interface unit to transfer information from an internal bus to the external bus.Type: GrantFiled: October 20, 2017Date of Patent: November 26, 2019Assignee: SMART Modular Technologies, Inc.Inventors: Fong-Long Lin, Kwang Jin Gooi, Satyanarayan Shivkumar Iyer
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Patent number: 9525807Abstract: A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device.Type: GrantFiled: January 19, 2016Date of Patent: December 20, 2016Assignee: NAN CHANG O-FILM OPTOELECTRONICS TECHNOLOGY LTDInventors: Kwang Jin Gooi, Tzer Nan Tan, Kean Leong Tai
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Publication number: 20160134790Abstract: A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device.Type: ApplicationFiled: January 19, 2016Publication date: May 12, 2016Inventors: Kwang Jin Gooi, Tzer Nan Tan, Kean Leong Tai
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Publication number: 20130070147Abstract: A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device.Type: ApplicationFiled: November 13, 2012Publication date: March 21, 2013Inventors: Kwang Jin Gooi, Tzer Nan Tan, Kean Leong Tai
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Patent number: 8308379Abstract: A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device.Type: GrantFiled: December 1, 2010Date of Patent: November 13, 2012Assignee: DigitalOptics CorporationInventors: Kwang Jin Gooi, Tzer Nan Tan, Kean Leong Tai
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Publication number: 20120141114Abstract: A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device.Type: ApplicationFiled: December 1, 2010Publication date: June 7, 2012Inventors: Kwang Jin Gooi, Tzer Nan Tan, Kean Leong Tai
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Publication number: 20090274311Abstract: An audio load box to test multiple audio channels using selectable loading for each channel. A resistive load is switched into the signal path of each audio channel before audio tests are conducted. The resistive load can be a single resistor or resistors in parallel. The multi-channel audio load box with selectable loading can provide greater flexibility, reliability and accuracy for tests, for example inter-channel phase measurements and crosstalk.Type: ApplicationFiled: April 30, 2008Publication date: November 5, 2009Applicant: AGILENT TECHNOLOGIES, INC.Inventors: Joo Teik Siew, Kwang Jin Gooi, Wai Beng Lam