Abstract: The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

Abstract: Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction towards the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

Abstract: The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

Abstract: The present invention discloses a method of detecting the presence of mutated genes, mRNAs or microRNAs in a subject. The method comprises the following steps: (1) Provide a body fluid sample containing cells, circulating tumor cells (CTCs), and/or extracellular vesicles (EVs); and use an analyzer having overhang molecular beacons to measure fluorescence signals generated by interactions between the body fluid sample and the overhang molecular beacons, so as to detect the presence of the mutated genes, mRNAs or microRNA. Furthermore, a biochip comprising a gold coating substrate and tethered lipoplex nanoparticles encapsulating the overhang molecular beacons is also provided in the invention.

Abstract: Described herein are compositions of therapeutic extracellular vesicles, and methods and systems of producing the therapeutic extracellular vesicles. Also described herein are methods of treating a disease or condition with the therapeutic extracellular vesicles.

Abstract: The present invention discloses a method of detecting the presence of mutated genes, mRNAs or microRNAs in a subject. The method comprises the following steps: (1) Provide a body fluid sample containing cells, circulating tumor cells (CTCs), and/or extracellular vesicles (EVs); and use an analyzer having overhang molecular beacons to measure fluorescence signals generated by interactions between the body fluid sample and the overhang molecular beacons, so as to detect the presence of the mutated genes, mRNAs or microRNA. Furthermore, a biochip comprising a gold coating substrate and tethered lipoplex nanoparticles encapsulating the overhang molecular beacons is also provided in the invention.

Abstract: The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.

Abstract: An adhesive composition for a semiconductor process, a film for a semiconductor process comprising the same, and a method for manufacturing a semiconductor package using the same are provided. The adhesive composition provides the film for a semiconductor process having excellent adhesion reliability to a wafer even during a process of debonding a carrier from the wafer.

Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.

Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

Abstract: The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.

Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

Abstract: Methods and systems for characterizing extracellular vesicular biomarkers using a biochip with gold nanoparticles. The biochip includes a glass surface, a gold film layer on the glass surface, a plurality of gold nanoparticles coupled to the gold film layer, and a plurality of biotinylated antibodies coupled to the gold nanoparticles. In some implementations, the gold film layer of the biochip is coated with polyethylene glycol (PEG). The biotinylated antibodies are selected to capture specific types of extracellular vesicles. PD-L1/PD-1 proteins and RNAs in extracellular vesicles were characterized for cancer immunotherapy.

Abstract: The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

Abstract: The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

Abstract: The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

Abstract: An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.