Patents by Inventor Kwang Jun Euh

Kwang Jun Euh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260152828
    Abstract: Provided is an aluminum casting alloy with high strength, high elongation and high thermal conductivity, including: 6.5% by weight or more and 11.5% by weight or less of silicon (Si); 0.2% by weight or more and 0.4% by weight or less of magnesium (Mg); 0.32% by weight or more and 0.85% by weight or less of iron (Fe); and a remainder including aluminum (Al) and inevitable impurities, wherein ?-AlFeSi intermetallic compound with a cubic crystal structure is included in an aluminum matrix.
    Type: Application
    Filed: October 18, 2022
    Publication date: June 4, 2026
    Inventors: Young Hee CHO, Su Hyeon KIM, Kwang Jun EUH, Jung Moo LEE, Soo Bae KIM, Seung Uk LEE
  • Patent number: 11654477
    Abstract: Provided is a method for manufacturing an aluminum alloy exterior material for smart devices which is formed not by extrusion or die casting but by a strip casting method using a rotating mold, and an aluminum alloy exterior material manufactured by the method. In accordance with an embodiment, the method includes: preparing a molten aluminum alloy; casting the molten aluminum alloy into a sheet shape using a rotating mold to form an aluminum alloy cast sheet; and anodizing the aluminum alloy cast sheet, wherein in the forming of an aluminum alloy cast sheet, X in Equation 1 below may have a value in the range of greater than 0 and equal to or less than 0.15. X=(WZn+WMg+WCu+WSi)/TC??<Equation 1> Here, WZn+WMg+WCu+WSi is the total content (wt %) of zinc, magnesium, copper and silicon) in the aluminum alloy, and TC is the thermal conductivity (W/m·K) of the rotating mold.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: May 23, 2023
    Assignee: KOREA INSTITUTE OF MATERIALS SCIENCE
    Inventors: Yun Soo Lee, Hyoung Wook Kim, Su Hyeon Kim, Kwang Jun Euh
  • Publication number: 20210016344
    Abstract: Provided is a method for manufacturing an aluminum alloy exterior material for smart devices which is formed not by extrusion or die casting but by a strip casting method using a rotating mold, and an aluminum alloy exterior material manufactured by the method. In accordance with an embodiment, the method includes: preparing a molted aluminum alloy; casting the molten aluminum alloy into a sheet shape using a rotating mold to form an aluminum alloy cast sheet; and anodizing the aluminum alloy cast sheet, wherein in the forming of an aluminum alloy cast sheet, X in Equation 1 below may have a value in the range of greater than 0 and equal to or less than 0.15. X=(WZn+WMg+WCu+WSi)/TC??<Equation 1> Here, WZn+WMg+WCu+WSi+WSi is the total content (wt %) of zinc, magnesium, copper and silicon) in the aluminum alloy, and TC is the thermal conductivity (W/m·K) of the rotating mold.
    Type: Application
    Filed: November 1, 2019
    Publication date: January 21, 2021
    Inventors: Yun Soo LEE, Hyoung Wook Kim, Su Hyeon Kim, Kwang Jun Euh
  • Patent number: 7056467
    Abstract: Disclosed herein is a method for producing a thin sheet of an Al—SiC composite material, which comprises the steps of: mixing aluminum powders and SiC powders to give spraying powders; and plasma-spraying the spraying powders on a graphite substrate to form a thin sheet. According to the method of the present invention, the composite material having low thermal expansion coefficient, high thermal conductivity and low density, which is suitable for use as a thermal management material for electronic devices, can be produced by a simple production process.
    Type: Grant
    Filed: September 2, 2003
    Date of Patent: June 6, 2006
    Inventors: Suk Bong Kang, Kwang Jun Euh, Manchang Gui
  • Publication number: 20040071896
    Abstract: Disclosed herein is a method for producing a thin sheet of an Al—SiC composite material, which comprises the steps of: mixing aluminum powders and SiC powders to give spraying powders; and plasma-spraying the spraying powders on a graphite substrate to form a thin sheet. According to the method of the present invention, the composite material having low thermal expansion coefficient, high thermal conductivity and low density, which is suitable for use as a thermal management material for electronic devices, can be produced by a simple production process.
    Type: Application
    Filed: September 2, 2003
    Publication date: April 15, 2004
    Inventors: Suk Bong Kang, Kwang Jun Euh, Manchang Gui