Patents by Inventor Kwang-Mahn Kim

Kwang-Mahn Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7449498
    Abstract: The present invention relates to composite materials for bone replacement comprising organic and inorganic material, more particularly to composite materials for bone replacement wherein cyanoacrylate as organic material and osteo-conductive inorganic material as inorganic material are combined. The composite materials synthesized according to the present invention, maximize the merits of organic material and inorganic material and minimize their demerits. In detail, the organic material has the maintenance of shape and the adhesive property and the inorganic material has the osteo-conductivity on a new bone. Therefore, the composite materials of the present invention can be applied to fill bone defects and replace bones, since they retain the excellent physical property.
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: November 11, 2008
    Assignee: Yesbio Co., Ltd.
    Inventors: Kyeong-Jun Park, Doug-Youn Lee, Sang-Bae Lee, Jeong-Jong Park, Ji-Ho Park, Kyoung-Nam Kim, Kwang-Mahn Kim
  • Publication number: 20060276562
    Abstract: The present invention relates to composite materials for bone replacement comprising organic material and inorganic material, more particularly to composite materials for bone displacement wherein cyanoacrylate as organic material and osteo-conductive inorganic material as inorganic material are combined. The composite materials synthesized according to the present invention, maximize the merits of organic material and inorganic material and minimize their demerits. In detail, the organic material has the maintenance of shape and the adhesive property and the inorganic material has the osteo-conductivity on a new bone. Therefore, the composite materials of the present invention can be applied to fill bone defects and replace bones, since they retain the excellent physical property.
    Type: Application
    Filed: December 8, 2005
    Publication date: December 7, 2006
    Inventors: Kyeong-Jun Park, Doug-Youn Lee, Sang-Bae Lee, Jeong-Jong Park, Ji-Ho Park, Kyoung-Nam Kim, Kwang-Mahn Kim