Abstract: A method for fabricating a semiconductor device is provided. The method includes: loading a substrate on a stage of an apparatus for inspecting the substrate; extracting a first light having a first wavelength from a light by using a light source; acquiring first position information on at least one focal point, formed on the substrate, based on the first wavelength by using a controller, the at least one focal point being a pre-calculated at least one focal point; adjusting a position of at least one from among an objective lens and at least one microsphere in a vertical direction by using the first position information in the controller; condensing the first light, which has passed through the at least one microsphere, on the at least one focal point formed on the substrate; and inspecting the substrate by using the first light condensed on the at least one focal point.

Abstract: A substrate inspection apparatus includes a light irradiating unit irradiating first light to an inspection target on a stage, a light detecting unit detecting second light reflected by the inspection target, a spectrum generator generating a first spectrum from the second light, a noise filter module removing a noise signal from the first spectrum to generate a second spectrum, a spectrum analyzer determining a first calibration parameter and a first calibration value thereof from the second spectrum, and a hardware controller adjusting at least one of the stage, the light irradiating unit and the light detecting unit using the first calibration parameter and the first calibration value.