Patents by Inventor Kwang-Ru Wang

Kwang-Ru Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6864554
    Abstract: An optoelectronic device is disclosed. The optoelectronic device comprises a transparent conductive substrate, an optoelectronic element, and a base. The transparent conductive substrate comprises a transparent plate, a transparent electrode film formed on the transparent plate, and an insulating part formed on the transparent plate. The insulating part divides the transparent electrode film into a first transparent electrode film and a second transparent electrode film that non-conduct each other. The optoelectronic element comprising a positive electrode and a negative electrode is disposed on the transparent conductive substrate and electrically connected to the first transparent electrode film and the second transparent electrode film individually. The base is formed with an opening that has a reflective surface on the bottom of the opening, and the optoelectronic element is held in the opening in a manner of suspending from or connecting with the bottom of the opening.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: March 8, 2005
    Assignee: Highlink Technology Corporation
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Patent number: 6856087
    Abstract: A full-color display device is disclosed. The present invention comprises a plurality of pixel units each comprising a base, a plurality of transparent conductive substrates, a plurality of light emitting elements, and a plurality of electrode parts. The base has at least three openings formed thereon, the bottom of each opening is a reflective surface, and each of the transparent conductive substrates individually covers each opening. Each of the light emitting elements is individually disposed on one side of each transparent conductive substrate and held in each opening. Each of the electrode parts is formed on the base and electrically connected to the electrodes of the light emitting elements and the transparent conductive substrates.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: February 15, 2005
    Assignee: Highlink Technology Corporation
    Inventors: Ming-Der Lin, Kwang-Ru Wang, Shih-Cheng Huang, Ming-Fa Yeh, Yi-Tai Chung
  • Patent number: 6812503
    Abstract: The present invention discloses a light-emitting device with improved reliability so as to achieve a prolonged lifetime, better stability and excellent illumination quality. The light-emitting device comprises a substrate; a light-emitting component, having a p-n junction, mounted on a top surface of the substrate so as to be connected to corresponding metal pads through at least one conducting wire; and a cap, formed of a transparent material to have an inward concave, wherein the light-emitting component is disposed in the inward concave such that there is a gap between the light-emitting component and the cap.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: November 2, 2004
    Assignee: Highlink Technology Corporation
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Patent number: 6809341
    Abstract: A light-emitting diode with enhanced brightness and a method for fabricating the diode is provided. The light-emitting diode includes an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of windows formed in a highly doped layer. At least one conductive contact is formed on the bottom surface of the highly doped layer. A transparent material layer is formed in the windows. An adhesion layer is formed between the transparent material layer and a permanent substrate. A bottom electrode is formed on the bottom surface of the permanent substrate and an opposed electrode is formed on the top surface of the epitaxial LED structure.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: October 26, 2004
    Assignee: Opto Tech University
    Inventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Hung-Yuan Lu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
  • Publication number: 20040178415
    Abstract: The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.
    Type: Application
    Filed: March 11, 2003
    Publication date: September 16, 2004
    Inventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Hung-Yuan Lu, Yen-Hu Chu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
  • Patent number: 6791151
    Abstract: A base of an optoelectronic device is disclosed. The present invention comprises an opening and a reflective surface. The base of the optoelectronic device incorporates with a transparent conductive substrate and an optoelectronic element to construct the optoelectronic device, wherein the optoelectronic element is disposed on the transparent conductive substrate, and the opening is used to hold the optoelectronic element. Moreover, the transparent conductive substrate is placed on the top of the opening, and the reflective surface is located at the bottom in the opening.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: September 14, 2004
    Assignee: Highlink Technology Corporation
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Patent number: 6737679
    Abstract: An optoelectronic unit and a transparent conductive substrate of the same are disclosed. The transparent conductive substrate comprises a transparent plate, a transparent electrode film, an insulation part, and a bounding pad, wherein the transparent electrode film and the insulation part are formed on the transparent plate, the insulation part divides the transparent electrode film into a first transparent electrode film area and a second transparent electrode film area that non-conduct each other, and the bounding pad is formed on the second transparent electrode film area. The optoelectronic unit comprises the aforementioned transparent conductive substrate, an optoelectronic element, and a conductive wire, wherein one electrode of the optoelectronic element is electrically connected to the aforementioned first transparent electrode film area, and the other electrode of the optoelectronic element is electrically connected to the aforementioned bounding pad by the conductive wire.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: May 18, 2004
    Assignee: Highlink Technology Corporation
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Publication number: 20040069999
    Abstract: An optoelectronic device is disclosed. The optoelectronic device comprises a transparent conductive substrate, an optoelectronic element, and a base. The transparent conductive substrate comprises a transparent plate, a transparent electrode film formed on the transparent plate, and an insulating part formed on the transparent plate. The insulating part divides the transparent electrode film into a first transparent electrode film and a second transparent electrode film that non-conduct each other. The optoelectronic element comprising a positive electrode and a negative electrode is disposed on the transparent conductive substrate and electrically connected to the first transparent electrode film and the second transparent electrode film individually. The base is formed with an opening that has a reflective surface on the bottom of the opening, and the optoelectronic element is held in the opening in a manner of suspending from or connecting with the bottom of the opening.
    Type: Application
    Filed: January 6, 2003
    Publication date: April 15, 2004
    Applicant: HIGHLINK TECHNOLOGY CORPORATION
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Publication number: 20040070333
    Abstract: A full-color display device is disclosed. The present invention comprises a plurality of pixel units each comprising a base, a plurality of transparent conductive substrates, a plurality of light emitting elements, and a plurality of electrode parts. The base has at least three openings formed thereon, the bottom of each opening is a reflective surface, and each of the transparent conductive substrates individually covers each opening. Each of the light emitting elements is individually disposed on one side of each transparent conductive substrate and held in each opening. Each of the electrode parts is formed on the base and electrically connected to the electrodes of the light emitting elements and the transparent conductive substrates.
    Type: Application
    Filed: January 6, 2003
    Publication date: April 15, 2004
    Applicant: HIGHLINK TECHNOLOGY CORPORATION
    Inventors: Ming-Der Lin, Kwang-Ru Wang, Shih-Cheng Huang, Ming-Fa Yeh, Yi-Tai Chung
  • Publication number: 20040070014
    Abstract: A base of an optoelectronic device is disclosed. The present invention comprises an opening and a reflective surface. The base of the optoelectronic device incorporates with a transparent conductive substrate and an optoelectronic element to construct the optoelectronic device, wherein the optoelectronic element is disposed on the transparent conductive substrate, and the opening is used to hold the optoelectronic element. Moreover, the transparent conductive substrate is placed on the top of the opening, and the reflective surface is located at the bottom in the opening.
    Type: Application
    Filed: January 6, 2003
    Publication date: April 15, 2004
    Applicant: HIGHLINK TECHNOLOGY CORPORATION
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Publication number: 20040069992
    Abstract: An optoelectronic unit and a transparent conductive substrate of the same are disclosed. The transparent conductive substrate comprises a transparent plate, a transparent electrode film, an insulation part, and a bounding pad, wherein the transparent electrode film and the insulation part are formed on the transparent plate, the insulation part divides the transparent electrode film into a first transparent electrode film area and a second transparent electrode film area that non-conduct each other, and the bounding pad is formed on the second transparent electrode film area. The optoelectronic unit comprises the aforementioned transparent conductive substrate, an optoelectronic element, and a conductive wire, wherein one electrode of the optoelectronic element is electrically connected to the aforementioned first transparent electrode film area, and the other electrode of the optoelectronic element is electrically connected to the aforementioned bounding pad by the conductive wire.
    Type: Application
    Filed: January 6, 2003
    Publication date: April 15, 2004
    Applicant: HIGHLINK TECHNOLOGY CORPORATION
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Patent number: 6716654
    Abstract: The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: April 6, 2004
    Assignee: Opto Tech Corporation
    Inventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Chia-Liang Hsu, Hung-Yuan Lu, Yen-Hu Chu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
  • Patent number: 6717711
    Abstract: A forming method and a structure of a high efficiency electro-optics device are disclosed. In the present invention, the cell-fixing surface between the die carrier and the electro-optics cell is decreased to increase the light emitting and absorbing regions of the electro-optics device. Thus, the operating efficiency and the sensitivity of the electro-optics device is increased substantially. Especially, the present invention has the advantage of fully showing the efficacy of device using the transparent substrate. Furthermore, when the electro-optics cell is fixing on the cell-fixing surface by utilizing the eutectic or metal-melting bonding method, a result of self-alignment can be achieved. Thus, the accuracy of the packaging device is increased substantially, thereby reducing the loss caused by the failure of poor cell-fixing while in mass production and meanwhile increasing the accuracy of fixing cell. Therefore, the present technology is quite suitable for use in the packaging of high precision.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: April 6, 2004
    Assignee: Opto Tech Corporation
    Inventors: Ming-Der Lin, Kwang-Ru Wang, Chang-Da Tsai, Jung-Kuei Hsu
  • Patent number: 6686218
    Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: February 3, 2004
    Assignee: Opto Tech Corporation
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Publication number: 20030173602
    Abstract: The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.
    Type: Application
    Filed: March 12, 2002
    Publication date: September 18, 2003
    Inventors: Jung-Kuei Hsu, Hsueh-Chih Yu, Chia-Liang Hsu, Hung-Yuan Lu, Yen-Hu Chu, Chui-Chuan Chang, Kwang-Ru Wang, Chang-Da Tsai, San Bao Lin, Yung-Chiang Hwang, Ming-Der Lin
  • Patent number: 6614058
    Abstract: A light emitting semiconductor device with a surface-mounted and flip-chip package structure is disclosed. The light emitting semiconductor device includes an insulating substrate and an LED. The LED includes a substrate, a first-type semiconductor layer, a first electrode formed on part of the first-type semiconductor layer surface, a second-type semiconductor layer formed on the first-type semiconductor layer surface but not covering the first electrode, and a second electrode formed on the second-type semiconductor layer. Two electrode layers are formed on the two sides of the insulating substrate and extend upwardly and downwardly to the upper and lower surface of the insulating substrate. The device is characterized in that the LED is mounted on the insulating substrate by a flip chip method and the insulating substrate is formed with two electrode layers at both side walls to surface-mounted with the LED.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: September 2, 2003
    Assignee: Highlink Technology Corporation
    Inventors: Ming-der Lin, Kwang-ru Wang
  • Patent number: 6603151
    Abstract: A method and a structure for packaging an electro-optics device are disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: August 5, 2003
    Assignee: Opto Tech Corporation
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Publication number: 20030100140
    Abstract: A method for packaging an electro-optics device is disclosed. A transparent material is added between the die carrier and the electro-optics device, so that the light emitted from the backside of the electro-optics device can be extracted. Furthermore, a light reflective layer is formed on the die carrier, and a pattern of the light reflective layer is designed to prevent the light from being reflected to the active layer, the reflecting decreasing light-emitting efficiency again.
    Type: Application
    Filed: January 15, 2003
    Publication date: May 29, 2003
    Applicant: OPTO TECH CORPORATION
    Inventors: Ming-Der Lin, Chang-Da Tsai, Kwang-Ru Wang, Ching-Liang Kao, Wen-Liang Tseng, Chia-Chen Chang
  • Publication number: 20030098651
    Abstract: The present invention discloses a light-emitting device with improved reliability so as to achieve a prolonged lifetime, better stability and excellent illumination quality. The light-emitting device comprises a substrate; a light-emitting component, having a p-n junction, mounted on a top surface of the substrate so as to be connected to corresponding metal pads through at least one conducting wire; and a cap, formed of a transparent material to have an inward concave, wherein the light-emitting component is disposed in the inward concave such that there is a gap between the light-emitting component and the cap.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 29, 2003
    Inventors: Ming-Der Lin, Kwang-Ru Wang
  • Publication number: 20030010986
    Abstract: A light emitting semiconductor device with a surface-mounted and flip-chip package structure is disclosed. The light emitting semiconductor device includes an insulating substrate and a LED. The LED includes a substrate, a first-type semiconductor layer, a first electrode formed on part of the first-type semiconductor layer surface, a second-type semiconductor layer formed on the first-type semiconductor layer surface but not covering the first electrode, and a second electrode formed on the second-type semiconductor layer. Two electrode layers are formed on the two sides of the insulating substrate and extend upwardly and downwardly to the upper and lower surface of the insulating substrate. The device is characterized in that the LED is mounted on the insulating substrate by a flip chip method and the insulating substrate is formed with two electrode layers at both side walls to surface-mounted with the LED.
    Type: Application
    Filed: July 9, 2002
    Publication date: January 16, 2003
    Inventors: Ming-der Lin, Kwang-ru Wang