Abstract: Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs.

Abstract: Provided is an optical hybrid module in which an optical device, a filter, an amplifier and an antenna are hybrid-integrated, which includes: a silicon optical bench disposed on a substrate and having an optical fiber and an optical device; an amplifier disposed on the substrate and connected to the optical device disposed on the silicon optical bench to amplify a signal transmitted from the optical device; and an antenna disposed on the substrate to be connected to the amplifier and transmitting a signal amplified by the amplifier. Thus, a foot-print module may be embodied by disposing an antenna and a filter on a single- or multi-layer substrate and providing a bias required for the optical device and the amplifier through a solder ball. Also, due to the antenna and filter disposed on the substrate, an expensive connector is not needed, and thus a production costs can be reduced.

Abstract: Provided is a reflection-type optical modulation module. According to the reflection-type optical modulation module, an anti-reflective thin film is formed on the optical input/output side surface of a waveguide to reduce optical coupling loss, and also a high-reflective thin film is formed on the opposite side surface to feed back a modulated optical signal. Thus, even when the length of an absorption layer is shortened, a sufficient optical path length is available, and it is possible to obtain a sufficient extinction ratio. Since the optical path length is sufficiently long despite a reduction in the length of the device, capacitance is reduced, and high-speed operation is enabled. In addition, only one lensed optical fiber for optical input and output is used, and thus it is possible to reduce production cost and the number of installation processes.

Abstract: Provided are an enhanced structure of a coplanar waveguide that is a kind of transmission line used for optical communication for radio frequency (RF), and an optical communication module employing the same. While having a basic structure including a conductive strip and ground strips at both sides of the conductive strip on a dielectric substrate, the coplanar waveguide has the structure in which metal patterns of a portion of the conductive strip located around points where an RF propagation direction is changed and of a portion of an inside ground strip are removed to make electrical lengths of an outside ground strip and the inside ground strip similar each other. Using the coplanar waveguide, it is possible to fabricate an optical module that has an optimized RF characteristic and also can freely change an RF propagation direction of several tens GHz, without an additional process.

Abstract: Provided is an optical module including a microstrip line, a traveling wave type optical device positioned in the end of the microstrip line, and at least one balanced open stub connected to the microstrip line for the impedance matching at a specific frequency such as 40 GHz and 60 GHz. For the fine tuning, laser trimming can be applied to the stub. A transition region is formed between the optical device and the microstrip line. A termination resistor is formed to face the microstrip line with the optical device therebetween. A bandwidth can be controlled at a specific frequency by adjusting a number of the stubs or a value of the termination resistor.

Abstract: An electroabsorption (EA) duplexer in which an optical amplifier, a photodetector, and an optical modulator are monolithically integrated to obtain a high radio frequency (RF) gain in radio-over fiber (RoF) link optical transmission technology is provided. The EA duplexer includes a substrate, a separation area, an optical detection/modulation unit, and an optical amplification unit. The separation area includes a first epitaxial layer formed of at least one material layer on the substrate. The first epitaxial layer functions as a first optical waveguide. The optical detection/modulation unit includes a second epitaxial layer formed of at least one material layer on the first epitaxial layer to detect and modulate an optical signal. The second epitaxial layer functions as a second optical waveguide. The optical amplification unit includes the second optical waveguide and a third epitaxial layer formed of at least one material layer on the second epitaxial layer to amplify an optical signal.

Abstract: A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed.

Abstract: A system for monitoring an optical output/wavelength is employed to be used for a WDM system having a narrow channel space by structuring an etalon and photodiode as an integrated structure.

Abstract: A system for monitoring an optical output/wavelength is employed to be used for a WDM system having a narrow channel space by structuring an etalon and photodiode as an integrated structure.

Abstract: A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed.

Abstract: A BGA semiconductor package including: a semiconductor chip on which a chip pad is formed; a flexible member formed on the semiconductor chip; a metal pattern formed on one surface of the flexible member; a connection member for electrically connecting the pad and the metal pattern; and an external terminal electrically connected to the metal pattern. A method for fabricating the BGA semiconductor package including the steps of: fabricating a flexible member; forming a metal pattern on one surface of the flexible member; forming a pad on one surface of the semiconductor chip; attaching the flexible member onto the semiconductor chip in a manner that the pad is exposed; electrically connecting the pad and the metal pattern; and attaching an external terminal onto a predetermined region of the metal pattern.

Abstract: A BGA semiconductor package including: a semiconductor chip on which a chip pad is formed; a flexible member formed on the semiconductor chip; a metal pattern formed on one surface of the flexible member; a connection member for electrically connecting the pad and the metal pattern; and an external terminal electrically connected to the metal pattern. A method for fabricating the BGA semiconductor package including the steps of: fabricating a flexible member; forming a metal pattern on one surface of the flexible member; forming a pad on one surface of the semiconductor chip; attaching the flexible member onto the semiconductor chip in a manner that the pad is exposed; electrically connecting the pad and the metal pattern; and attaching an external terminal onto a predetermined region of the metal pattern.

Abstract: A BGA semiconductor package including: a semiconductor chip on which a chip pad is formed; a flexible member formed on the semiconductor chip; a metal pattern formed on one surface of the flexible member; a connection member for electrically connecting the pad and the metal pattern; and an external terminal electrically connected to the metal pattern. A method for fabricating the BGA semiconductor package including the steps of: fabricating a flexible member; forming a metal pattern on one surface of the flexible member; forming a pad on one surface of the semiconductor chip; attaching the flexible member onto the semiconductor chip in a manner that the pad is exposed; electrically connecting the pad and the metal pattern; and attaching an external terminal onto a predetermined region of the metal pattern.