Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.

Abstract: The flow rate control device includes a main plate corresponding to an inner diameter and including a through hole which is formed at the center thereof and through which a fluid flows, a sub-plate corresponding to a size of the through hole, disposed in front of the main plate, and applied with a pressure of the flowing fluid, and an expansion and contraction flow path formed to connect the through hole and a circumference of the sub-plate to each other and expanded and contracted by the pressure applied to the sub-plate. The expansion and contraction flow path includes a plurality of holes which are formed in a side surface thereof and through which the flow flows, and has a cross-sectional area changed by the pressure to control a flow rate.

Abstract: A photocatalytic coating composition is provided. The composition comprises a hydroxyapatite-coated photocatalyst, a silica-based binder, an acrylic emulsion, a thickener and water. Further provided is a radiant heating system having the composition. The system has deodorizing and antibacterial properties.

Abstract: A photocatalytic coating composition is provided. The composition comprises a hydroxyapatite-coated photocatalyst, a silica-based binder, an acrylic emulsion, a thickener and water. Further provided is a radiant heating system having the composition. The system has deodorizing and antibacterial properties.