Abstract: The present invention relates to a resin composition suitable for an ion beam, ion plasma or ion implanation treatment. The resin is consists of one or more components selected from polyphenylene oxide, polycarbonate, polybuthylene terephthalate, polysulfone, polyethylene terephthalate, polyethersulfone, polyphenylenesulfide, polystyrene, acrylonitrile-butadiene-styrene copolymer, polyetherimide, polyamide, polymethylmethacrylate, polyacetal, polyethylene, polyropylene, styrene-butadiene rubber, ethylene-propylene rubber and EPDM rubber. So this resin having a proper conductivity is very useful for a packing material of cellular phone, computer monitor, liquid crystal display, and a IC film or tube.