Abstract: A display device includes: an insulating substrate, where a through hole is defined through the insulating substrate; and an organic layer which covers the insulating substrate. In the display device, a barrier area surrounding the through hole is defined in the insulating substrate, and an interruption portion, at which the organic layer is interrupted, is defined in the barrier area.

Abstract: According to one example of the present disclosure, an electrode assembly manufacturing device may be provided, which comprises: a supply part supplying a packaging separator having a packaging length corresponding to the length of the electrode assembly; a packaging part provided so that the packaging separator supplied from the supply part is divided into a folded region and a reference region where the reference surface of the electrode assembly is seated, adsorbed, and seated, and provided to fold the packaging separator so that the folded region is placed on the opposite side of the electrode assembly facing the reference surface of the electrode assembly; and a sealing part sealing the packaging separator located on the opposite side to the electrode assembly after the packaging separator is folded.

Abstract: The present invention relates to a plated steel sheet having excellent corrosion resistance, workability and surface quality, and at the same time, capable of reducing occurrence of liquid metal embrittlement (LME).

Abstract: The present disclosure relates to a modified polypeptide of glutamine synthetase having enhanced activity and a method of producing L-glutamine using the same. Since production of L-glutamine may be increased by using the novel modified polypeptide without a decrease in a growth rate compared to wild-type strains having glutamine synthetase activity, the modified polypeptide may be widely used for mass production of L-glutamine.

Abstract: An example includes: a package substrate having a die pad with a device side surface and a thermal pad on an opposite side surface; a thermal dissipation structure mounted to the die pad, the thermal dissipation structure including a thermally conductive insulator core and thermal conductors on a device side surface and on a substrate mount surface opposite the device side surface; at least one semiconductor device die mounted to the device side surface of the thermal dissipation structure; electrical connections formed between leads on the package substrate and bond pads on the at least one semiconductor device die; and mold compound covering the electrical connections, the at least one semiconductor device, and portions of the package substrate, portions of the leads of the package substrate forming terminals, and the thermal pad exposed from the mold compound and forming a thermal pad for a semiconductor device package.

Abstract: Embodiments described herein relate to an optical device and methods of forming an optical device. The optical device includes a substrate, an illumination source, a capping layer, an encapsulation layer, and a passivation layer. The encapsulation layer includes a first atomic layer deposition (ALD) layer, a chemical vapor deposition (CVD) layer, and a second ALD layer. The method includes disposing a capping layer over an illumination layer, the illumination layer disposed over a substrate in a processing chamber; disposing a first atomic layer deposition (ALD) layer over the capping layer; disposing a chemical vapor deposition (CVD) layer over the first ALD layer; disposing a second ALD layer over the CVD layer; and disposing a passivation layer over the second ALD layer.

Abstract: A method of estimating hemoglobin concentration, may comprise: receiving a skin image of a subject; determining a formula into which the skin image is introduced; and estimating a hemoglobin concentration of the subject by introducing the skin image into the determined formula.

Abstract: A display device includes a display panel including a peripheral region adjacent to a light-emitting region, and a reflection preventing facing the display panel. The reflection preventing layer includes a light-blocking pattern corresponding to the peripheral region and defining an opening corresponding to the light-emitting region, a color filter in the opening of the light-blocking pattern, and a protruding pattern corresponding to the light-blocking pattern.

Abstract: A vehicle airbag device according to an embodiment of the present invention may include a cushion which includes a chamber inflated by gas and in which vent holes are formed in both side surfaces of the cushion, a vent tube which is disposed in the chamber, into which the gas is introduced, and which is connected to the pair of vent holes to connect the pair of vent holes to each other and guides the introduced gas toward the vent holes, and a tether which is disposed in the chamber and tightens and closes the vent tube as the cushion inflates.

Abstract: Provided is a collector including an adhesion enhancing layer capable of providing a positive electrode having excellent adhesion and low interfacial resistance, a positive electrode including the same, and a lithium secondary battery including the positive electrode. The collector includes a conductive metal layer, and an adhesion enhancing layer provided on at least one surface of the conductive metal layer, wherein the adhesion enhancing layer has a surface roughness (Ra) of 90 nm to 600 nm and a diiodomethane contact angle of 70° to 120°.

Abstract: A display device includes a first pad group including first pads spaced apart in a first direction, a second pad group spaced apart from the first pad group in a second direction crossing the first direction, and including second pads spaced apart in the first direction, inspection lines between the first pads, extending in the second direction, spaced apart in the first direction, and respectively connected to the second pads, and a dummy pad between adjacent ones of the inspection lines.

Abstract: A lighting device disclosed in an embodiment of the invention includes a substrate; a plurality of light sources disposed on the substrate; a resin layer covering the light source on the substrate; a light blocking layer having an opening portion on the resin layer; and a lens plate disposed on the light blocking layer, wherein the lens plate includes a light transmitting portion and a convex portion arranged on one surface or the other surface of the light transmitting portion, and the total area of the opening portions is 50% or less of an area of an emission surface through which light is emitted through the resin layer, and the interval between the lens plate and the light blocking layer may be greater than the length of the opening portion.

Abstract: Provided is a method for preventing, ameliorating, or treating inflammatory diseases by administering a composition containing extracellular vesicles (EVs) derived from Roseburia spp. strains and/or Bifidobacterium spp. strains, wherein the EVs exhibits effectiveness in improving inflammatory bowel disease (IBD), and additionally, all EVs derived from congeneric strains corresponding to Roseburia spp. strains or Bifidobacterium spp. strains. have been confirmed to exhibit strong anti-inflammatory effect, and the strains and EVs derived therefrom can be provided as a composition for preventing, ameliorating, or treating a variety of inflammatory diseases.

Abstract: A display device includes a light emitting sub-pixel disposed in a display area, a light receiving pixel disposed in one of the display area or a non-display area, and a touch sensing layer including a sensing conductive layer overlapping with the light receiving pixel.

Abstract: A power supply system may include a target device and an adapter. The target device may include an adapter connection switch that receives adapter recognition information to form a connection with the adapter, a voltage detection unit that receives an output voltage from an adapter, and a voltage-change-requesting unit that outputs a voltage to request a voltage change based on information on the output voltage from the adapter. The adapter may include a device information recognition unit that receives the voltage to request a voltage change, and an output-voltage-changing unit that changes the output voltage based on the voltage to request a voltage change.

Abstract: A semiconductor package includes a first redistribution layer structure, a first set of semiconductor dies on the first redistribution layer structure, a plurality of connection members on the first redistribution layer structure and around the first set of semiconductor dies, a molding material on the first redistribution layer structure, the molding material covering the first set of semiconductor dies and at least partially surrounding the plurality of connection members, a second redistribution layer structure on the molding material, a second set of semiconductor dies on the second redistribution layer structure, and a dummy structure on the second redistribution layer structure and between a first semiconductor die of the second set of semiconductor dies and a second semiconductor die of the second set of semiconductor dies.

Abstract: A semiconductor package includes a redistribution structure, a semiconductor die on the redistribution structure, one or more memory stacking structures disposed on the redistribution structure, wherein the one or more memory stacking structures and the semiconductor die are arranged side by side on the redistribution structure, an optical engine disposed on the redistribution structure, wherein the optical engine and the semiconductor die are arranged side by side on the redistribution structure, and a heat dissipation structure on the semiconductor die, the one or more memory stacking structures, and the optical engine, wherein levels of upper surfaces of the semiconductor die, the one or more memory stacking structures, and the optical engine are the same.

Abstract: An image decoding method and an image decoding apparatus is provided. The method comprises recovering a first motion vector corresponding to a first decoding reference picture based on the entropy decoded bit stream, calculating a second motion vector corresponding to a second decoding reference picture by scaling the first motion vector based on a first temporal distance between the current picture and the first decoding reference picture and a second temporal distance between the current picture and the second decoding reference picture, generating a prediction block relating to a current block in the current picture, based on the calculated second motion vector, generating a residual block relating to the current block through a residual data decoding process based on the entropy decoded bit stream, and recovering the current block based on the prediction block and the residual block.

Abstract: A semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a first mold layer at least partially covering the first redistribution substrate and the first semiconductor chip, a plurality of first conductive pillars at least partially penetrating the first mold layer and contacting the first redistribution substrate, a second redistribution substrate on the first mold layer, a second semiconductor chip on the second redistribution substrate, a second mold layer at least partially covering the second redistribution substrate and the second semiconductor chip, a plurality of second conductive pillars at least partially penetrating the second mold layer and contacting the second redistribution substrate, and a third redistribution substrate on the second mold layer. The first semiconductor chip includes a first through via. The second semiconductor chip includes a backside power delivery network layer.

Abstract: A display device includes a substrate including a display area and a driving circuit area, a first transistor in the display area, and including a first active layer on the substrate and a first gate electrode on the first active layer, a first gate insulating layer between the first active layer and the first gate electrode, and entirely covering the first active layer, a second transistor in the driving circuit area, and including a second active layer on the substrate and a second gate electrode on the second active layer, a second gate insulating layer between the second active layer and the second gate electrode, covering a part of the second active layer overlapping the second gate electrode, and exposing another part of the second active layer, and a first oxide semiconductor layer between the first gate insulating layer and the first gate electrode.