Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a resid

Abstract: An apparatus for baking a wafer includes a heating plate for supporting the wafer to be baked, a lifting device for loading and unloading the wafer onto and from the upper surface of the heating plate, and a detector for detecting whether the wafer loaded by the lifting device onto the upper surface of the heating plate extends parallel to the upper surface, i.e., is situated correctly on the heating plate. The detector includes proximity sensors and a controller. The proximity sensors are disposed in or on the heating plate for sensing respective distances from the positions thereof to the wafer and generating signals indicative of whether the wafer is disposed more than a predetermined distance away from the sensors. The controller determines, on the basis of the signals generated by the proximity sensors, whether the baking process should be carried out and controls the baking process once it is initiated.

Abstract: An apparatus for baking a wafer includes a heating plate for supporting the wafer to be baked, a lifting device for loading and unloading the wafer onto and from the upper surface of the heating plate, and a detector for detecting whether the wafer loaded by the lifting device onto the upper surface of the heating plate extends parallel to the upper surface, i.e., is situated correctly on the heating plate. The detector includes proximity sensors and a controller. The proximity sensors are disposed in or on the heating plate for sensing respective distances from the positions thereof to the wafer and generating signals indicative of whether the wafer is disposed more than a predetermined distance away from the sensors. The controller determines, on the basis of the signals generated by the proximity sensors, whether the baking process should be carried out and controls the baking process once it is initiated.