Patents by Inventor Kwang-Tae Lee

Kwang-Tae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board
    Patent number: 8426739
    Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: April 23, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Kwang Tae Lee, Sung Gue Lee, Jae Bong Choi
  • Printed Circuit Board and Method for Manufacturing the Same, and Panel for Manufacturing the Printed Circuit Board
    Publication number: 20110036618
    Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
    Type: Application
    Filed: December 1, 2008
    Publication date: February 17, 2011
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Kwang Tae Lee, Sung Gue Lee, Jae Bong Choi
  • Method for manufacturing printed circuit board
    Patent number: 7208341
    Abstract: A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of t
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: April 24, 2007
    Assignee: LG Electronics Inc.
    Inventors: Kwang-Tae Lee, Sung-Gue Lee, Sang-Hyuck Nam, Sung-Ho Youn, Young-Kyu Lee
  • Method for manufacturing printed circuit board
    Publication number: 20040241904
    Abstract: A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of t
    Type: Application
    Filed: May 28, 2004
    Publication date: December 2, 2004
    Applicant: LG Electronics Inc.
    Inventors: Kwang-Tae Lee, Sung-Gue Lee, Sang-Hyuck Nam, Sung-Ho Youn, Young-Kyu Lee