Patents by Inventor Kwang-Tae Lee

Kwang-Tae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131943
    Abstract: An apparatus for holding a cable for an electric vehicle charger includes a cable holding unit configured to restrict a charging cable extended and connected to a charging coupler, and to ascend or descend to predetermined positions, a housing unit mounted in a manner that is rotatable along a leftward-rightward direction, the cable holding unit being accommodated inside the housing unit, a driving unit configured to provide drive power for enabling the cable holding unit to ascend and descend and drive power for rotating the housing unit, and a control unit configured to control the driving unit in such a manner that the cabling holding unit and the housing unit are selectively driven when the charging coupler is removed from an electric vehicle charger or rests thereon.
    Type: Application
    Filed: February 6, 2023
    Publication date: April 25, 2024
    Inventors: Woo Hyung Lee, Su Hwan Cho, Young Tae Choi, Kwang Min Oh, Ho Choi
  • Patent number: 11951130
    Abstract: The present invention relates to an antigen-binding molecule comprising a heavy chain variable region comprising a heavy-chain complementarity-determining region 1 (HCDR1) comprising an amino acid sequence represented by Sequence No. 1, an HCDR2 comprising an amino acid sequence represented by Sequence No. 2, and an HCDR3 comprising an amino acid sequence represented by Sequence No. 3; a light-chain variable region comprising a light-chain complementarity-determining region 1 (LCDR1) comprising an amino acid sequence represented by Sequence No. 4, an LCDR2 comprising an amino acid sequence represented by Sequence No. 5, and an LCDR3 comprising an amino acid sequence represented by Sequence No. 6; wherein the antigen-binding molecule is a T cell receptor (TCR); and to a cell line expressing the same.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: April 9, 2024
    Assignee: Eutilex Co., Ltd.
    Inventors: Byoung S. Kwon, Young Ho Kim, Kwang Hee Kim, Ji Won Chung, Young Gyoon Chang, Bo Rim Yi, Jung Yun Lee, Seung Hyun Lee, Sun Woo Im, Jin Kyung Choi, Hyun Tae Son, Eun Hye Yoo
  • Publication number: 20240092141
    Abstract: An air conditioning device for a vehicle includes: a housing having an inside divided into an inflow space, a heat exchange space, and an outflow space, which are straightly arranged, and having a plurality of discharge ports, which communicates with an interior, at the inflow space; a blowing unit disposed at the inflow space of the housing and configured to blow air; a heat exchange unit disposed at the heat exchange space of the housing and configured to adjust a temperature of conditioned air by exchanging heat with air; and an opening-closing door disposed at the outflow space of the housing and configured to open and close the plurality of discharge ports such that conditioned air at an adjusted temperature selectively flows to the plurality of discharge ports. The air conditioning device adjusts the temperature of conditioned air for respective modes and reduces a flow resistance of air.
    Type: Application
    Filed: March 8, 2023
    Publication date: March 21, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DOOWON CLIMATE CONTROL CO., LTD.
    Inventors: Kwang Ok Han, Young Tae Song, Yong Chul Kim, Gee Young Shin, Su Yeon Kang, Jae Sik Choi, Dae Hee Lee, Byeong Moo Jang, Ung Hwi Kim, Jae Won Cha, Won Jun Joung, Byung Guk An
  • Patent number: 8426739
    Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: April 23, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Kwang Tae Lee, Sung Gue Lee, Jae Bong Choi
  • Publication number: 20110036618
    Abstract: Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
    Type: Application
    Filed: December 1, 2008
    Publication date: February 17, 2011
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Kwang Tae Lee, Sung Gue Lee, Jae Bong Choi
  • Patent number: 7208341
    Abstract: A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of t
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: April 24, 2007
    Assignee: LG Electronics Inc.
    Inventors: Kwang-Tae Lee, Sung-Gue Lee, Sang-Hyuck Nam, Sung-Ho Youn, Young-Kyu Lee
  • Publication number: 20040241904
    Abstract: A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of t
    Type: Application
    Filed: May 28, 2004
    Publication date: December 2, 2004
    Applicant: LG Electronics Inc.
    Inventors: Kwang-Tae Lee, Sung-Gue Lee, Sang-Hyuck Nam, Sung-Ho Youn, Young-Kyu Lee