Patents by Inventor Kwang Yong Chung

Kwang Yong Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system including ribbon bond interconnect
    Patent number: 7443018
    Abstract: An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: October 28, 2008
    Assignees: Stats Chippac Ltd., Orthodyne Electronics Corporation
    Inventors: You Yang Ong, Kwang Yong Chung, Mohd Helmy Bin Ahmad, Garrett L. Wong, Christoph B. Luechinger
  • INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING RIBBON BOND INTERCONNECT
    Publication number: 20070108601
    Abstract: An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
    Type: Application
    Filed: November 9, 2005
    Publication date: May 17, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: You Yang Ong, Kwang Yong Chung, Mohd Ahmad