Abstract: An exemplary embodiment provides an operating method of a software fault-tolerant handling system, and more particularly, to an operating method of a fault-tolerant handling system in which a fault recovery is easy in a fault-tolerant technology of copying with various faults which can occur in a computing device.

Abstract: Provided are an apparatus and method for enhancing security and safety of an embedded system by monitoring and blocking unauthorized execution of a shell command in the embedded system. The apparatus for guaranteeing safe execution of the shell command in the embedded system includes a shell command detection part configured to detect an execution request of the shell command, and a shell command execution control part configured to control execution of the shell command according to whether a password based on safety is provided for the detected shell command.

Abstract: A method of performing communication with a second communication device by a first communication device is provided. The method includes identifying an Internet Protocol (IP) address for communication with a first communication network, providing data including the IP address to the second communication device connected through a second communication network, and executing a communication application being connected with the second communication device via the first communication network using the IP address.

Abstract: A key apparatus of an electronic device is provided. The key apparatus includes a housing having a cylindrical portion, the cylindrical portion including an upper portion and a lower portion, the upper portion and the lower portion being open, a knob including a circular-plate portion, the circular plate portion having a concavo-convex portion, the concavo-convex portion including a concave portion and a convex portion arranged alternately in a circular shape and an extension portion extended from the circular-plate portion in a downward direction and inserted into a hollow of the cylindrical portion, and the knob moves on the circular-plate portion, an anti-deviation unit configured to prevent the knob from being deviated from the cylindrical portion, an elastic configured to elastically press the concavo-convex portion at a lower side of the circular-plate portion, and a switch connected to the extension portion and switches over movement of the extension portion is delivered.

Abstract: Disclosed herein are an apparatus and method for displaying images. The apparatus includes a first image output unit, a second image output unit, an image signal selection unit, and an image display unit. The first image output unit is set to master operation mode, and outputs an image signal to be displayed. The second image output unit is set to slave operation mode, and, if the first image output unit has failed, is switched to master operation mode and then continuously outputs the image signal or a new image signal. The image signal selection unit compares the IP source address of a received master message with previously stored address information, and then selects the image signal that is received from the first image output unit or the second image output unit that has a matching address. The image display unit displays the selected image signal.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.

Abstract: The present invention relates to a molding material for a fuel cell separator including a graphite complex having a mixture of expandable graphite and non-expandable graphite; at least one of the conductive fillers selected from the group consisting of carbon black, carbon fiber and carbon nanotube; and at least one resin selected from a thermoplastic resin and thermosetting resin. With the present invention, both the mechanical strength and electrical conductivity of the fuel cell separator can be simultaneously improved.

Abstract: A computer system security apparatus and a security method thereof, the apparatus including a recognition unit to recognize identification information of a user; an operation unit to produce a result value by executing a predetermined operation on the identification information of the user and unique identification information of the computer system; and a main control unit to execute a booting of the computer system according to whether a preset password of the computer system and the result value are the same.

Abstract: A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.

Abstract: A computer system and a control method thereof, the computer system including: a processor which executes a program; a communication unit which communicates with an external device; a main body which is provided with the processor. A cover which can be opened and shut with regard to the main body; an open/shut sensor which senses whether the cover is open or shut; and a controller which interrupts an operation of the communication unit if the open/shut sensor senses that the cover is shut.

Abstract: An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.

Abstract: A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.

Abstract: A partial rebooting recovery apparatus is provided. The partial rebooting recovery apparatus may store a system state of a predetermined booting point in time, may receive a failure signal of a system, may call a failure recovery processing function, may recover the system to the system state of the predetermined booting point in time, based on the failure signal, and may reboot the system from a point in time at which the system is recovered.

Abstract: An apparatus and a method for providing a character deletion function is provided. A plurality of deletion items having respective designated deletion schemes are displayed, when there is a request for a deletion mode while inputting characters. It is determined if a Drag event occurs after a Press event occurs in an area where one of the plurality of deletion items is displayed. It is determined if a Release event occurs when the Drag event occurs. A deletion function in a deletion scheme corresponding to a deletion item having an area where the Release event occurs is performed when the Release event occurs. Accordingly, a user has convenience with which, when inputting characters, the user receives various deletion schemes and can perform a desired deletion function in a simple way.

Abstract: A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process.

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract: Provided are a system and method for allocating a specific job or application to a specific slave core by using an inter-core-communication (ICC) channel and executing the job or application in a multicore system environment including the master core and a plurality of slave cores. The method of a master core, includes: initializing message transmission times; generating an event for processing a instruction received from an application program and generating a channel event message from the event; checking a process for transmitting the generated channel event message, and if a channel event message queue corresponding to an event transmitting request is not “FULL” of a previously-stored channel event message, transmitting the channel event message to a specific slave core to request for storing the channel event message; and returning a response of processing status to the request for storing the channel event message to the application program.

Abstract: A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

Abstract: A semiconductor package and method of manufacturing thereof are provided. The package includes: a substrate; a first metal wire on a top surface of the substrate; a first semiconductor chip disposed on the substrate; a first insulation layer which covers the first semiconductor chip and at least a part of the substrate; a second metal wire formed on a top surface of the first insulation layer; a first via formed in the first insulation layer, wherein the first via electrically connects the second metal wire and the first metal wire; and a second semiconductor chip disposed on the second metal wire, wherein the second semiconductor chip is electrically connected to the second metal wire.